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FPD200 PDF预览

FPD200

更新时间: 2024-01-22 19:50:14
品牌 Logo 应用领域
FILTRONIC /
页数 文件大小 规格书
2页 186K
描述
GENERAL PURPOSE PHEMT

FPD200 技术参数

生命周期:Transferred包装说明:,
Reach Compliance Code:unknown风险等级:5.6
Base Number Matches:1

FPD200 数据手册

 浏览型号FPD200的Datasheet PDF文件第2页 
FPD200  
GENERAL PURPOSE PHEMT  
DRAIN  
BOND  
FEATURES  
PAD (1X)  
19 dBm Linear Output Power at 12 GHz  
12 dB Power Gain at 12 GHz  
17 dB Maximum Stable Gain at 12 GHz  
12 dB Maximum Stable Gain at 18 GHz  
45% Power-Added Efficiency  
SOURCE  
BOND  
PAD (2x)  
GATE  
BOND  
PAD (1X)  
DIE SIZE (µm): 400 x 400  
DIE THICKNESS: 75 µm  
BONDING PADS (µm): >80 x 80  
DESCRIPTION AND APPLICATIONS  
The FPD200is an AlGaAs/InGaAs pseudomorphic High Electron Mobility Transistor (PHEMT),  
featuring a 0.25 µm by 200 µm Schottky barrier gate, defined by high-resolution stepper-based  
photolithography. The recessed and offset Gate structure minimizes parasitics to optimize  
performance. The epitaxial structure and processing have been optimized for reliable medium-  
power applications. The FPD200 also features Si3N4 passivation and is available in a low cost  
plastic package.  
Typical applications include commercial and other narrowband and broadband high-performance  
amplifiers, including SATCOM uplink transmitters, PCS/Cellular low-voltage high-efficiency output  
amplifiers, and medium-haul digital radio transmitters.  
ELECTRICAL SPECIFICATIONS AT 22°C  
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max Units  
RF SPECIFICATIONS MEASURED AT f = 12 GHz USING CW SIGNAL  
Power at 1dB Gain Compression  
Power Gain at P1dB  
P1dB  
G1dB  
PAE  
VDS = 5 V; IDS = 50% IDSS  
VDS = 5 V; IDS = 50% IDSS  
18  
10.5  
19  
12.0  
45  
dBm  
dB  
%
Power-Added Efficiency  
V
DS = 5V; IDS = 50% IDSS  
;
POUT = P1dB  
Maximum Stable Gain (S21/S12)  
f = 12 GHz  
SSG  
VDS = 5 V; IDS = 50% IDSS  
16  
10.5  
17  
12  
dB  
f = 24 GHz  
Saturated Drain-Source Current  
Maximum Drain-Source Current  
Transconductance  
Gate-Source Leakage Current  
Pinch-Off Voltage  
Gate-Source Breakdown Voltage  
Gate-Drain Breakdown Voltage  
Thermal Resistivity (see Notes)  
IDSS  
IMAX  
GM  
IGSO  
|VP|  
VDS = 1.3 V; VGS = 0 V  
VDS = 1.3 V; VGS +1 V  
VDS = 1.3 V; VGS = 0 V  
VGS = -5 V  
VDS = 1.3 V; IDS = 0.2 mA  
IGS = 0.2 mA  
45  
60  
120  
80  
75  
mA  
mA  
mS  
µA  
V
1
10  
1.3  
0.7  
12.0  
14.5  
1.0  
14.0  
16.0  
280  
|VBDGS  
|VBDGD  
|
|
V
V
IGD = 0.2 mA  
V
DS > 3V  
θJC  
°C/W  
Phone: +1 408 850-5790  
Fax: +1 408 850-5766  
http://www.filtronic.co.uk/semis  
Revised: 11/17/04  
Email: sales@filcsi.com  

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