Datasheet v3.0
GENERAL PURPOSE PHEMT DIE
FEATURES:
LAYOUT:
•
•
•
•
•
19 dBm Output Power (P1dB)
13 dB Power Gain at 12 GHz
17 dB Maximum Stable Gain at 12 GHz
12 dB Maximum Stable Gain at 18 GHz
45% Power-Added Efficiency
GENERAL DESCRIPTION:
The
FPD200
is
an
AlGaAs/InGaAs
Mobility
pseudomorphic
High
Electron
Transistor (pHEMT), featuring a 0.25 µm by
200 µm Schottky barrier gate, defined by high-
resolution stepper-based photolithography.
The recessed gate structure minimizes
TYPICAL APPLICATIONS:
•
Narrowband and broadband high-
performance amplifiers
parasitics to optimize performance.
epitaxial structure and processing have been
The
•
•
SATCOM uplink transmitters
PCS/Cellular low-voltage high-efficiency
output amplifiers
optimized
for
reliable
medium-power
applications.
•
Medium-haul digital radio transmitters
1
ELECTRICAL SPECIFICATIONS :
PARAMETER
Power at 1dB Gain Compression
Power Gain at P1dB
SYMBOL
P1dB
CONDITIONS
MIN TYP
MAX
UNITS
dBm
VDS = 5 V; IDS = 50% IDSS
VDS = 5 V; IDS = 50% IDSS
18
19
G1dB
11.0
13.0
dB
Noise Figure
N.F.min
PAE
VDS = 5 V; IDS = 50% IDSS
1.2
45
dB
%
Power-Added Efficiency
VDS = 5V; IDS = 50% IDSS; POUT = P1dB
Maximum Stable Gain (S21/S12)
f = 12 GHz
MSG
VDS = 5 V; IDS = 50% IDSS
16
17
12
dB
dB
f = 24 GHz
10.5
Saturated Drain-Source Current
Maximum Drain-Source Current
IDSS
IMAX
VDS = 1.3 V; VGS = 0 V
45
60
75
mA
mA
120
VDS = 1.3 V; VGS ≅ +1 V
Transconductance
Gate-Source Leakage Current
Pinch-Off Voltage
GM
IGSO
VDS = 1.3 V; VGS = 0 V
VGS = -5 V
80
1
mS
10
µA
V
|VP|
VDS = 1.3 V; IDS = 0.2 mA
IGS = 0.2 mA
0.7
1.0
14.0
16.0
280
1.3
Gate-Source Breakdown Voltage
Gate-Drain Breakdown Voltage
Thermal Resistivity
|VBDGS|
|VBDGD|
θJC
12.0
14.5
V
IGD = 0.2 mA
V
VDS > 3V
°C/W
Note: 1 TAmbient = 22°C; RF specifications measured at f = 12 GHz using CW signal on a sample basis
1
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com