是否无铅: | 含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 零件包装代码: | MODULE |
包装说明: | FLANGE MOUNT, R-XUFM-X11 | 针数: | 11 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
风险等级: | 5.06 | 外壳连接: | ISOLATED |
最大集电极电流 (IC): | 500 A | 集电极-发射极最大电压: | 1200 V |
配置: | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR | 门极-发射极最大电压: | 20 V |
JESD-30 代码: | R-XUFM-X11 | 元件数量: | 2 |
端子数量: | 11 | 最高工作温度: | 150 °C |
封装主体材料: | UNSPECIFIED | 封装形状: | RECTANGULAR |
封装形式: | FLANGE MOUNT | 峰值回流温度(摄氏度): | NOT SPECIFIED |
极性/信道类型: | N-CHANNEL | 最大功率耗散 (Abs): | 1450 W |
认证状态: | Not Qualified | 子类别: | Insulated Gate BIP Transistors |
表面贴装: | NO | 端子形式: | UNSPECIFIED |
端子位置: | UPPER | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
晶体管元件材料: | SILICON | 标称断开时间 (toff): | 810 ns |
标称接通时间 (ton): | 400 ns | VCEsat-Max: | 2.15 V |
Base Number Matches: | 1 |
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