September 2005
TM
UniFET
FDAF69N25
250V N-Channel MOSFET
Features
Description
•
•
•
•
•
34A, 250V, R
= 0.041Ω @V = 10 V
These N-Channel enhancement mode power field effect transis-
tors are produced using Fairchild’s proprietary, planar stripe,
DMOS technology.
DS(on)
GS
Low gate charge ( typical 77 nC)
Low Crss ( typical 84 pF)
Fast switching
This advanced technology has been especially tailored to mini-
mize on-state resistance, provide superior switching perfor-
mance, and withstand high energy pulse in the avalanche and
commutation mode. These devices are well suited for high effi-
ciency switching DC/DC converters and switched mode power
supplies.
Improved dv/dt capability
D
{
z
ꢀ ꢁ
z
z
G{
TO-3PF
FQAF Series
{
S
G
D S
Absolute Maximum Ratings
Symbol
Parameter
FDAF69N25
Unit
V
V
Drain-Source Voltage
Repetitive Avalanche Voltage
250
300
V
V
DSS
(Note 1)
(Note 2)
DS(Avalanche)
I
Drain Current
- Continuous (T = 25°C)
34
21.5
A
A
D
C
- Continuous (T = 100°C)
C
(Note 1)
(Note 2)
I
Drain Current
- Pulsed
136
30
A
V
DM
V
E
Gate-Source Voltage
GSS
AS
Single Pulsed Avalanche Energy
Avalanche Current
1894
34
mJ
A
I
(Note 1)
(Note 1)
(Note 3)
AR
E
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
11.5
4.5
mJ
V/ns
AR
dv/dt
P
Power Dissipation
(T = 25°C)
115
W
D
C
- Derate above 25°C
0.93
W/°C
T
T
T
Operating and Storage Temperature Range
-55 to +150
300
°C
J, STG
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
L
°C
Thermal Characteristics
Symbol
Parameter
Min.
Max.
1.08
--
Unit
°C/W
°C/W
°C/W
R
R
R
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink
--
0.24
--
θJC
θCS
θJA
Thermal Resistance, Junction-to-Ambient
40
©2005 Fairchild Semiconductor Corporation
FDAF69N25 Rev. A
1
www.fairchildsemi.com