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FCB20N60_F085 PDF预览

FCB20N60_F085

更新时间: 2024-11-18 21:19:11
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 开关晶体管
页数 文件大小 规格书
6页 357K
描述
Power Field-Effect Transistor, 20A I(D), 600V, 0.198ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, ROHS COMPLIANT PACKAGE-3/2

FCB20N60_F085 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:2
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.69
雪崩能效等级(Eas):480 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:600 V
最大漏极电流 (ID):20 A最大漏源导通电阻:0.198 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):245极性/信道类型:N-CHANNEL
参考标准:AEC-Q101表面贴装:YES
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FCB20N60_F085 数据手册

 浏览型号FCB20N60_F085的Datasheet PDF文件第2页浏览型号FCB20N60_F085的Datasheet PDF文件第3页浏览型号FCB20N60_F085的Datasheet PDF文件第4页浏览型号FCB20N60_F085的Datasheet PDF文件第5页浏览型号FCB20N60_F085的Datasheet PDF文件第6页 
November  
2013  
FCB20N60_F085  
N-Channel MOSFET  
600V, 20A, 198mΩ  
D
D
Features  
„ Typ r  
= 173mΩ at V = 10V, I = 20A  
GS D  
DS(on)  
„ Typ Q  
= 72nC at V = 10V, I = 20A  
GS D  
g(tot)  
G
„ UIS Capability  
„ RoHS Compliant  
„ Qualified to AEC Q101  
G
S
S
Description  
TM  
SuperFET is Fairchild’s proprietary new generation of high  
voltage MOSFETs utilizing an advanced charge balance  
mechanism for outstanding low on-resistance and  
For current package drawing, please refer to the Fairchild  
website at www.fairchildsemi.com/packaging  
lower gate charge performance.  
This advanced technology has been tailored to minimize  
conduction loss, provide superior switching performance, and  
withstand extreme dv/dt rate and higher avalanche energy.  
Consequently, SuperFET is suitable for various automotive  
DC/DC power conversion.  
Applications  
„ Automotive On Board Charger  
„ Automotive DC/DC converter for HEV  
MOSFET Maximum Ratings TJ = 25°C unless otherwise noted  
Symbol  
VDSS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
600  
±30  
V
V
VGS  
Drain Current - Continuous (VGS=10) (Note 1)  
Pulsed Drain Current  
TC = 25°C  
TC = 25°C  
20  
ID  
A
See Figure4  
480  
EAS  
PD  
Single Pulse Avalanche Energy  
(Note 2)  
(Note 3)  
mJ  
W
W/oC  
oC  
oC/W  
oC/W  
Power Dissipation  
Derate above 25oC  
341  
2.3  
TJ, TSTG Operating and Storage Temperature  
-55 to + 150  
0.44  
RθJC  
RθJA  
Thermal Resistance Junction to Case  
Maximum Thermal Resistance Junction to Ambient  
43  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
24mm  
Quantity  
800 units  
FCB20N60  
FCB20N60_F085  
TO-263AB  
330mm  
Notes:  
1: Current is limited by bondwire configuration.  
2: Starting T = 25°C, L = 15mH, I = 8A, V = 100V during inductor charging and V = 0V during time in avalanche  
J
AS  
DD  
DD  
3: RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder  
mounting surface of the drain pins. RθJC is guaranteed by design while RθJAis determined by the user's board design. The maximum rating  
2
presented here is based on mounting on a 1 in pad of 2oz copper.  
©2013 Fairchild Semiconductor Corporation  
FCB20N60_F085 Rev. C1  
1
www.fairchildsemi.com  

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