Datasheet > ESD9D5.0S

ESD9D5.0S

更新时间： 2022-02-26 13:07:35

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
4页	69K
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Transient Voltage Suppressors

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ESD9D5.0S 数据手册

ESD9D5.0S

Transient Voltage

Suppressors

ESD Protection Diodes with Ultra−Low

Capacitance

www.onsemi.com

The ESD9D5.0 is designed to protect voltage sensitive components

that require ultra−low capacitance from ESD and transient voltage

events. Excellent clamping capability, low capacitance, low leakage,

and fast response time, make these parts ideal for ESD protection on

designs where board space is at a premium. Because of its low

capacitance, it is suited for use in high frequency designs such as USB

2.0 high speed and antenna line applications.

PIN 1. CATHODE

2. ANODE

Specification Features:

• Ultra Low Capacitance 0.6 pF

• Low Clamping Voltage

SOD−923

CASE 514AB

• Small Body Outline Dimensions:

0.039″ x 0.024″ (1.00 mm x 0.60 mm)

• Low Body Height: 0.016″ (0.4 mm)

• Stand−off Voltage: 5 V

• Low Leakage

MARKING DIAGRAM

• Response Time is Typically < 1.0 ns

• IEC61000−4−2 Level 4 ESD Protection

• This is a Pb−Free Device

BB M

Mechanical Characteristics:

CASE: Void-free, transfer-molded, thermosetting plastic

Epoxy Meets UL 94 V−0

= Specific Device Code

= Date Code

LEAD FINISH: 100% Matte Sn (Tin)

MOUNTING POSITION: Any

ORDERING INFORMATION

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 1 Requirements

†

Device

Package

Shipping

ESD9D5.0ST5G SOD−923

(Pb−Free)

8000/Tape & Reel

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

IEC 61000−4−2 (ESD)

Contact

Air

Total Power Dissipation on FR−5 Board

°P °

150

(Note 1) @ T = 25°C

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics tables starting on

page 2 of this data sheet.

Storage Temperature Range

Junction Temperature Range

−55 to +150

−55 to +125

260

°C

stg

Lead Solder Temperature − Maximum

(10 Second Duration)

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. FR−5 = 1.0 x 0.75 x 0.62 in.

See Application Note AND8308/D for further description of survivability specs.

Publication Order Number:

September, 2015 − Rev. 1

ESD9D5.0S/D

12 3 4

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