ESD9C3.3ST5G SERIES
ESD Protection Diodes
In Ultra Small SOD−923 Package
The ESD9C3.3ST5G Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage, and
fast response time make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its small size, it is suited
for use in cellular phones, portable devices, digital cameras, power
supplies and many other portable applications.
http://onsemi.com
1
2
Specification Features:
PIN 1. CATHODE
2. ANODE
• Small Body Outline Dimensions:
0.039″ x 0.024″ (1.0 mm x 0.60 mm)
• Low Body Height: 0.016″ (0.40 mm) Max
• Stand−off Voltage: 3.3 V, 5 V
• Low Leakage
MARKING
DIAGRAM
• Response Time < 1 ns
X M
SOD−923
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
• IEC61000−4−2 Level 4 ESD Protection
• These are Pb−Free Devices
CASE 514AB
X
M
= Specific Device Code
= Date Code
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
ORDERING INFORMATION
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
†
Device
ESD9CxxST5G
Package
Shipping
SOD−923 8000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Total Power Dissipation on FR−5 Board
⎪P
mW
D
(Note 1) @ T = 25°C
150
A
DEVICE MARKING INFORMATION
Junction and Storage Temperature
Range
T , T
−55 to +150
°C
°C
J
stg
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
Lead Solder Temperature − Maximum
(10 Second Duration)
T
260
L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
©
Semiconductor Components Industries, LLC, 2007
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Publication Order Number:
April, 2007 − Rev. 0
ESD9C3.3S/D