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ESD9CXXST5G PDF预览

ESD9CXXST5G

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
安森美 - ONSEMI 二极管
页数 文件大小 规格书
3页 39K
描述
ESD Protection Diodes In Ultra Small SOD-923 Package

ESD9CXXST5G 数据手册

 浏览型号ESD9CXXST5G的Datasheet PDF文件第2页浏览型号ESD9CXXST5G的Datasheet PDF文件第3页 
ESD9C3.3ST5G SERIES  
ESD Protection Diodes  
In Ultra Small SOD−923 Package  
The ESD9C3.3ST5G Series is designed to protect voltage sensitive  
components from ESD. Excellent clamping capability, low leakage, and  
fast response time make these parts ideal for ESD protection on designs  
where board space is at a premium. Because of its small size, it is suited  
for use in cellular phones, portable devices, digital cameras, power  
supplies and many other portable applications.  
http://onsemi.com  
1
2
Specification Features:  
PIN 1. CATHODE  
2. ANODE  
Small Body Outline Dimensions:  
0.039x 0.024(1.0 mm x 0.60 mm)  
Low Body Height: 0.016(0.40 mm) Max  
Stand−off Voltage: 3.3 V, 5 V  
Low Leakage  
MARKING  
DIAGRAM  
Response Time < 1 ns  
X M  
SOD−923  
ESD Rating of Class 3 (> 16 kV) per Human Body Model  
IEC61000−4−2 Level 4 ESD Protection  
These are Pb−Free Devices  
CASE 514AB  
X
M
= Specific Device Code  
= Date Code  
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94 V−0  
ORDERING INFORMATION  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
Device  
ESD9CxxST5G  
Package  
Shipping  
SOD−923 8000/Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
Total Power Dissipation on FR−5 Board  
P  
mW  
D
(Note 1) @ T = 25°C  
150  
A
DEVICE MARKING INFORMATION  
Junction and Storage Temperature  
Range  
T , T  
−55 to +150  
°C  
°C  
J
stg  
See specific marking information in the device marking  
column of the table on page 2 of this data sheet.  
Lead Solder Temperature − Maximum  
(10 Second Duration)  
T
260  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR−5 = 1.0 x 0.75 x 0.62 in.  
©
Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
April, 2007 − Rev. 0  
ESD9C3.3S/D  
 

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