是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | MO-219, ULTRA FINE LINE, BGA-88 | 针数: | 88 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.51 | 风险等级: | 4.24 |
Is Samacsys: | N | 最大时钟频率 (fCLK): | 66.7 MHz |
JESD-30 代码: | R-PBGA-B88 | JESD-609代码: | e1 |
长度: | 11 mm | 内存密度: | 16777216 bit |
内存集成电路类型: | CONFIGURATION MEMORY | 内存宽度: | 16 |
湿度敏感等级: | 3 | 功能数量: | 1 |
端子数量: | 88 | 字数: | 1048576 words |
字数代码: | 1000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 1MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装等效代码: | BGA88,8X12,32 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 260 |
电源: | 3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.4 mm | 最大待机电流: | 0.00015 A |
子类别: | Flash Memories | 最大压摆率: | 0.09 mA |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 类型: | NOR TYPE |
宽度: | 8 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
EPC16UC88 | ALTERA |
类似代替 |
2. Enhanced Configuration Devices (EPC4, EPC8 & EPC16) Data Sheet | |
EPC16UI88AA | ALTERA |
功能相似 |
Enhanced Configuration (EPC) Devices Datasheet |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
EPC16UI88AA | ALTERA |
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Enhanced Configuration (EPC) Devices Datasheet | |
EPC16XXX | ALTERA |
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EPC17 | TDK |
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Ferrite Cores For Power Supply and Signal Transformer EPC Cores | |
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Configuration Devices for SRAM-Based LUT Devices | |
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Configuration Devices for SRAM-Based | |
EPC1LI20 | INTEL |
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Configuration Memory, 1046496X1, Serial, MOS, PQCC20, PLASTIC, LCC-20 |