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EPC2105ENGRT PDF预览

EPC2105ENGRT

更新时间: 2024-02-12 02:56:43
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描述
MOSFET 2NCH 80V 9.5A DIE

EPC2105ENGRT 数据手册

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eGaN® FET DATASHEET  
EPC2105  
EPC2105 – Enhancement-Mode GaN Power  
Transistor Half-Bridge  
VDS , 80 V  
EFFICIENT POWER CONVERSION  
RDS(on) , 14.5 mΩ (Q1), 3.6 mΩ (Q2)  
ID , 10 A (Q1), 40 A (Q2)  
HAL  
Gallium Nitride’s exceptionally high electron mobility and low temperature coefficient allows very  
low RDS(on), while its lateral device structure and majority carrier diode provide exceptionally low QG  
and zero QRR. The end result is a device that can handle tasks where very high switching frequency,  
and low on-time are beneficial as well as those where on-state losses dominate.  
Maximum Ratings  
DEVICE  
PARAMETER  
VALUE  
UNIT  
EPC2105 eGaN® ICs are supplied only in  
passivated die form with solder bumps  
Die Size: 6.05 mm x 2.3 mm  
Drain-to-Source Voltage (Continuous)  
Drain-to-Source Voltage (up to 10,000 5 ms pulses at 150°C)  
Continuous (TA = 25°C, RθJA = 45°C/W)  
Pulsed (25°C, TPULSE = 300 µs)  
80  
VDS  
V
96  
10  
ID  
A
V
Applications  
70  
Q1  
Gate-to-Source Voltage  
6
• High Frequency DC-DC  
VGS  
TJ  
Gate-to-Source Voltage  
-4  
Benefits  
Operating Temperature  
–40 to 150  
°C  
V
TSTG Storage Temperature  
–40 to 150  
• High Frequency Operation  
Drain-to-Source Voltage (Continuous)  
VDS  
80  
• Ultra High Efficiency  
Drain-to-Source Voltage (up to 10,000 5 ms pulses at 150°C)  
96  
Continuous (TA = 25°C, RθJA = 11°C/W)  
40  
• High Density Footprint  
ID  
A
Pulsed (25°C, TPULSE = 300 µs)  
300  
6
Q2  
Gate-to-Source Voltage  
VGS  
V
Gate-to-Source Voltage  
-4  
TJ  
Operating Temperature  
–40 to 150  
–40 to 150  
°C  
TSTG Storage Temperature  
Thermal Characteristics  
PARAMETER  
TYP  
0.4  
2.5  
42  
UNIT  
RθJC  
RθJB  
RθJA  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Board  
Thermal Resistance, Junction-to-Ambient (Note 1)  
Q1  
°C/W  
Note 1: RθJA is determined with the device mounted on one square inch of copper pad, single layer 2 oz copper on FR4 board.  
See https://epc-co.com/epc/documents/product-training/Appnote_Thermal_Performance_of_eGaN_FETs.pdf for details  
EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2020 |  
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