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EIC1010-8

更新时间: 2024-01-24 03:13:09
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描述
10.00-10.70 GHz 8-Watt Internally Matched Power FET

EIC1010-8 数据手册

  
EIC1010-8  
UPDATED 02/15/2005  
10.00-10.70 GHz 8-Watt Internally Matched Power FET  
FEATURES  
Excelics  
EIC1010-8  
10.00– 10.70GHz Bandwidth  
Input/Output Impedance Matched to 50 Ohms  
+39.5 dBm Output Power at 1dB Compression  
7.0 dB Power Gain at 1dB Compression  
31% Power Added Efficiency  
-46 dBc IM3 at Po = 28.5 dBm SCL  
Hermetic Metal Flange Package  
100% Tested for DC, RF, and RTH  
YM  
SN  
Caution! ESD sensitive device.  
ELECTRICAL CHARACTERISTICS (Ta = 25°C)  
SYMBOL  
P1dB  
PARAMETERS/TEST CONDITIONS1  
Output Power at 1dB Compression f = 10.00-10.70GHz  
MIN  
TYP  
MAX  
UNITS  
38.5  
39.5  
dBm  
VDS = 10 V, IDSQ 2200mA  
Gain at 1dB Compression  
DS = 10 V, IDSQ 2200mA  
Gain Flatness  
DS = 10 V, IDSQ 2200mA  
Power Added Efficiency at 1dB Compression  
f = 10.00-10.70GHz  
G1dB  
6.0  
7.0  
dB  
dB  
V
f = 10.00-10.70GHz  
±0.6  
G  
V
PAE  
Id1dB  
31  
%
VDS = 10 V, IDSQ 2200mA  
f = 10.00-10.70GHz  
Drain Current at 1dB Compression f = 10.00-10.70GHz  
2300  
2600  
mA  
Output 3rd Order Intermodulation Distortion  
IM3  
f = 10 MHz 2-Tone Test; Pout = 28.5 dBm S.C.L2  
-43  
-46  
dBc  
VDS = 10 V, IDSQ 65% IDSS  
f = 10.70 GHz  
IDSS  
VP  
Saturated Drain Current  
VDS = 3 V, VGS = 0 V  
4000  
-2.5  
3.5  
5000  
-4.0  
4.0  
mA  
V
oC/W  
Pinch-off Voltage  
Thermal Resistance3  
V
DS = 3 V, IDS = 40 mA  
RTH  
1) Tested with 100 Ohm gate resistor.  
2) S.C.L. = Single Carrier Level.  
3) Overall Rth depends on case mounting.  
ABSOLUTE MAXIMUM RATING1,2  
SYMBOL  
CHARACTERISTIC  
VALUE  
VDS  
VGS  
IDS  
Drain to Source Voltage  
10 V  
-4.5 V  
Gate to Source Voltage  
Drain Current  
IDSS  
IGSF  
PIN  
Forward Gate Current  
Input Power  
80 mA  
@ 3dB compression  
38 W  
PT  
Total Power Dissipation  
Channel Temperature  
Storage Temperature  
TCH  
TSTG  
175°C  
-65/+175°C  
Notes:  
1.  
2.  
Operating the device beyond any of the above ratings may result in permanent damage or reduction of MTTF.  
Bias conditions must also satisfy the following equation PT < (TCH –TPKG)/RTH; where TPKG = temperature of package, and PT = (VDS * IDS) – (POUT – PIN).  
Specifications are subject to change without notice.  
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085  
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com  
page 1 of 1  
Revised February 2005  

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