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EDJ5308BASE-AG-E PDF预览

EDJ5308BASE-AG-E

更新时间: 2024-11-28 12:20:55
品牌 Logo 应用领域
尔必达 - ELPIDA 存储内存集成电路动态存储器双倍数据速率
页数 文件大小 规格书
130页 1562K
描述
512M bits DDR3 SDRAM

EDJ5308BASE-AG-E 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:TFBGA, BGA78,9X13,32
针数:78Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.28
风险等级:5.84Is Samacsys:N
访问模式:MULTI BANK PAGE BURST最长访问时间:0.265 ns
其他特性:AUTO/SELF REFRESHI/O 类型:COMMON
交错的突发长度:4,8JESD-30 代码:R-PBGA-B78
JESD-609代码:e1长度:10.8 mm
内存密度:536870912 bit内存集成电路类型:DDR DRAM
内存宽度:8功能数量:1
端口数量:1端子数量:78
字数:67108864 words字数代码:64000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:组织:64MX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装等效代码:BGA78,9X13,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):NOT SPECIFIED电源:1.5 V
认证状态:Not Qualified刷新周期:8192
座面最大高度:1.2 mm自我刷新:YES
连续突发长度:4,8子类别:DRAMs
最大供电电压 (Vsup):1.575 V最小供电电压 (Vsup):1.425 V
标称供电电压 (Vsup):1.5 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:9.8 mmBase Number Matches:1

EDJ5308BASE-AG-E 数据手册

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PRELIMINARY DATA SHEET  
512M bits DDR3 SDRAM  
EDJ5304BASE (128M words × 4 bits)  
EDJ5308BASE (64M words × 8 bits)  
EDJ5316BASE (32M words × 16 bits)  
Features  
pecifications  
Dsity: 5
Organiza
16M wonks (EDJ5304BASE)  
8M words anks (5308BASE)  
4M words × 16 ts × 8 ba(EDJ5316BASE)  
Package  
Double-data-rate architecture; two data transfers per  
clock cycle  
The high-speed data transfer is realized by the 8 bits  
prefetch pipelined architecture  
Bi-directional differential data strobe (DQS and /DQS)  
is transmitted/received with data for capturing data at  
the receiver  
78-ball FBGA (EDJ5/5308BASE)  
96-ball FBGA (EDJ531ASE)  
Lead-free (RoHS complia
Power supply: VDD, VDDQ = 1.5V 0.075V  
Data rate  
1333Mbps/1066Mbps/800Mbps (max
1KB page size (EDJ5304/5308BASE)  
Row address: A0 to A12  
DQS is edge-aligned with data for READs; center-  
aligned with data for WRITEs  
Differential clock inputs (CK and /CK)  
DLL aligns DQ and DQS transitions with CK  
transitions  
Commands entered on each positive CK edge; data  
and data mask referenced to both edges of DQS  
Data mask (DM) for write data  
ted /CAS by programmable additive latency for  
better command and data bus efficiency  
Column address: A0 to A9, A11 (EDJ5304BASE)  
A0 to A9 (EDJ5308BASE)  
On-Termination (ODT) for better signal quality  
us ODT  
DT  
nous ODT  
Multi Purpose r (MP) for temperature read  
out  
2KB page size (EDJ5316BASE)  
Row address: A0 to A11  
Column address: A0 to A9  
Eight internal banks for concurrent operation  
Interface: SSTL_15  
Burst lengths (BL): 8 and 4 with Burst Chop (BC)  
Burst type (BT):  
Sequential (8, 4 with BC)  
ZQ calibrae and ODT  
ProgrammaArray lf-Refresh (PASR)  
/RESET pin for wer-up uence and reset  
function  
Interleave (8, 4 with BC)  
/CAS Latency (CL): 5, 6, 7, 8, 9, 10  
/CAS Write Latency (CWL): 5, 6, 7, 8  
Precharge: auto precharge option for each burst  
access  
SRT range:  
Normal/extended  
Auto/manual self-refresh  
Programmable Output driver impence cont
Driver strength: RZQ/7, RZQ/6 (RZQ = 240Ω)  
Refresh: auto-refresh, self-refresh  
Refresh cycles  
Average refresh period  
7.8μs at 0°C TC ≤ +85°C  
3.9μs at +85°C < TC ≤ +95°C  
Operating case temperature range  
TC = 0°C to +95°C  
Document No. E0966E60 (Ver. 6.0) This product became EOL in September, 2010.  
Date Published July 2007 (K) Japan  
Printed in Japan  
URL: http://www.elpida.com  
©Elpida Memory, Inc. 2006-2007  

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