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EDJ4208EFBG PDF预览

EDJ4208EFBG

更新时间: 2024-11-28 12:55:47
品牌 Logo 应用领域
尔必达 - ELPIDA 动态存储器双倍数据速率
页数 文件大小 规格书
29页 426K
描述
4G bits DDR3L SDRAM

EDJ4208EFBG 数据手册

 浏览型号EDJ4208EFBG的Datasheet PDF文件第2页浏览型号EDJ4208EFBG的Datasheet PDF文件第3页浏览型号EDJ4208EFBG的Datasheet PDF文件第4页浏览型号EDJ4208EFBG的Datasheet PDF文件第5页浏览型号EDJ4208EFBG的Datasheet PDF文件第6页浏览型号EDJ4208EFBG的Datasheet PDF文件第7页 
COVER  
DATA SHEET  
4G bits DDR3L SDRAM  
EDJ4204EFBG (1024M words × 4 bits)  
EDJ4208EFBG (512M words × 8 bits)  
EDJ4216EFBG (256M words × 16 bits)  
Specifications  
Features  
• Density: 4G bits  
• Organization  
• Double-data-rate architecture: two data transfers per  
clock cycle  
• The high-speed data transfer is realized by the 8 bits  
prefetch pipelined architecture  
• Bi-directional differential data strobe (DQS and /DQS)  
is transmitted/received with data for capturing data at  
the receiver  
— 128M words × 4 bits × 8 banks (EDJ4204EFBG)  
— 64M words × 8 bits × 8 banks (EDJ4208EFBG)  
— 32M words × 16 bits × 8 banks (EDJ4216EFBG)  
• Package  
— 78-ball FBGA (EDJ4204EFBG, EDJ4208EFBG)  
— 96-ball FBGA (EDJ4216EFBG)  
— Lead-free (RoHS compliant) and Halogen-free  
• Power supply: 1.35V (typ)  
• DQS is edge-aligned with data for READs; center-  
aligned with data for WRITEs  
• Differential clock inputs (CK and /CK)  
• DLL aligns DQ and DQS transitions with CK transitions  
— VDD = 1.283V to 1.45V  
— Backward compatible for VDD, VDDQ  
= 1.5V 0.075V  
• Commands entered on each positive CK edge; data  
and data mask referenced to both edges of DQS  
• Data mask (DM) for write data  
• Data rate  
— 1600Mbps/1333Mbps (max)  
• 1KB page size  
• Posted /CAS by programmable additive latency for  
better command and data bus efficiency  
• On-Die Termination (ODT) for better signal quality  
— Synchronous ODT  
— Row address: A0 to A15  
— Column address: A0 to A9, A11 (EDJ4204EFBG)  
A0 to A9 (EDJ4208EFBG)  
— Dynamic ODT  
— Asynchronous ODT  
• Multi Purpose Register (MPR) for pre-defined pattern  
read out  
• 2KB page size (EDJ4216EFBG)  
— Row address: A0 to A14  
• ZQ calibration for DQ drive and ODT  
• Programmable Partial Array Self-Refresh (PASR)  
• /RESET pin for Power-up sequence and reset function  
• SRT range:  
— Normal/extended  
• Programmable Output driver impedance control  
— Column address: A0 to A9  
• Eight internal banks for concurrent operation  
• Burst length (BL): 8 and 4 with Burst Chop (BC)  
• Burst type (BT):  
— Sequential (8, 4 with BC)  
— Interleave (8, 4 with BC)  
• /CAS Latency (CL): 5, 6, 7, 8, 9, 10, 11  
• /CAS Write Latency (CWL): 5, 6, 7, 8  
• Precharge: auto precharge option for each burst  
access  
• Driver strength: RZQ/7, RZQ/6 (RZQ = 240Ω)  
• Refresh: auto-refresh, self-refresh  
• Refresh cycles  
— Average refresh period  
7.8μs at 0°C TC +85°C  
3.9μs at +85°C < TC +95°C  
• Operating case temperature range  
— TC = 0°C to +95°C  
Document. No. E1922E20 (Ver. 2.0)  
Date Published May 2013 (K) Japan  
Printed in Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2012-2013  

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