是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | DFN |
包装说明: | HVSON, SOLCC10,.16,20 | 针数: | 10 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 5.13 | 可调阈值: | NO |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | R-XDSO-N10 |
JESD-609代码: | e3 | 长度: | 4 mm |
湿度敏感等级: | 1 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 10 |
最高工作温度: | 70 °C | 最低工作温度: | -20 °C |
封装主体材料: | UNSPECIFIED | 封装代码: | HVSON |
封装等效代码: | SOLCC10,.16,20 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 260 |
电源: | 2.5/10 V | 认证状态: | Not Qualified |
座面最大高度: | 0.8 mm | 子类别: | Power Management Circuits |
最大供电电流 (Isup): | 0.095 mA | 最大供电电压 (Vsup): | 10 V |
最小供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
温度等级: | OTHER | 端子面层: | Matte Tin (Sn) |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 3 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
DS2781G-A2+T&R | MAXIM |
完全替代 ![]() |
Power Supply Support Circuit, Fixed, 1 Channel, PDSO10, 3 X 4 MM, ROHS COMPLIANT, TDFN-10 |
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DS2781G+ | MAXIM |
类似代替 ![]() |
Power Supply Support Circuit, Fixed, 1 Channel, 3 X 4 MM, LEAD FREE, TDFN-10 |
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DS2781G/T&R+W | MAXIM |
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DS2781G-A2+T&R | MAXIM |
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