是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | DFN |
包装说明: | HVSON, SOLCC10,.16,20 | 针数: | 10 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 0.79 |
可调阈值: | YES | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-XDSO-N10 | JESD-609代码: | e4 |
长度: | 4 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 10 | 最高工作温度: | 70 °C |
最低工作温度: | -20 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | HVSON | 封装等效代码: | SOLCC10,.16,20 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 电源: | 3/5 V |
认证状态: | Not Qualified | 座面最大高度: | 0.8 mm |
子类别: | Power Management Circuits | 最大供电电流 (Isup): | 0.105 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
温度等级: | COMMERCIAL | 端子面层: | NICKEL PALLADIUM GOLD |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 3 mm | Base Number Matches: | 1 |
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