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DMN3033LSN-7 PDF预览

DMN3033LSN-7

更新时间: 2024-11-09 09:54:15
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美台 - DIODES /
页数 文件大小 规格书
5页 129K
描述
N-CHANNEL ENHANCEMENT MODE MOSFET

DMN3033LSN-7 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SC-59
包装说明:SMALL OUTLINE, R-PDSO-G3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
Factory Lead Time:15 weeks风险等级:1.63
其他特性:HIGH RELIABILITY配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):6 A
最大漏极电流 (ID):6 A最大漏源导通电阻:0.03 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G3
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):1.4 W
最大脉冲漏极电流 (IDM):24 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:40
晶体管元件材料:SILICONBase Number Matches:1

DMN3033LSN-7 数据手册

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DMN3033LSN  
N-CHANNEL ENHANCEMENT MODE MOSFET  
Please click here to visit our online spice models database.  
Features  
Mechanical Data  
Low Gate Charge  
Low RDS(ON)  
Case: SC-59  
:
Case Material - Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish – Matte Tin annealed over Copper leadframe.  
Solderable per MIL-STD-202, Method 208  
Terminal Connections: See Diagram  
Marking Information: See Page 4  
Ordering Information: See Page 4  
Weight: 0.008 grams (approximate)  
30 mΩ @VGS = 10V  
40 mΩ @VGS = 4.5V  
Low Input/Output Leakage  
Lead Free By Design/RoHS Compliant (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
"Green" Device (Note 4)  
Drain  
D
SC-59  
Gate  
S
G
Source  
Top View  
Equivalent Circuit  
Pin Configuration  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
30  
Unit  
V
Gate-Source Voltage  
V
VGSS  
±20  
Drain Current (Note 1) Continuous  
TA = 25°C  
TA = 70°C  
6
5
A
ID  
Pulsed Drain Current (Note 2)  
24  
A
A
IDM  
IS  
Body-Diode Continuous Current (Note 1)  
2.25  
Thermal Characteristics @TA = 25°C unless otherwise specified  
Characteristic  
Total Power Dissipation (Note 1)  
Symbol  
PD  
Rθ  
Value  
1.4  
Unit  
W
Thermal Resistance, Junction to Ambient (Note 1) t 10s  
90  
°C /W  
°C  
JA  
Operating and Storage Temperature Range  
-55 to +150  
TJ, TSTG  
Notes:  
1. Device mounted on 1"x1", FR-4 PC board with 2 oz. Copper and test pulse width t 10s.  
2. Repetitive Rating, pulse width limited by junction temperature.  
3. No purposefully added lead.  
4. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.  
1 of 5  
www.diodes.com  
January 2010  
© Diodes Incorporated  
DMN3033LSN  
Document number: DS31116 Rev. 5 - 2  

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