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DF2B6.8SC PDF预览

DF2B6.8SC

更新时间: 2024-09-18 21:11:39
品牌 Logo 应用领域
东芝 - TOSHIBA 局域网二极管
页数 文件大小 规格书
8页 279K
描述
Protection Diodes against ESD

DF2B6.8SC 技术参数

生命周期:Active包装说明:R-XBCC-N2
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.74
最大击穿电压:7.8 V最小击穿电压:5.8 V
配置:SINGLE二极管元件材料:SILICON
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODEJESD-30 代码:R-XBCC-N2
元件数量:1端子数量:2
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:CHIP CARRIER
极性:BIDIRECTIONAL参考标准:IEC-61000-4-5
最大重复峰值反向电压:5 V表面贴装:YES
技术:AVALANCHE端子形式:NO LEAD
端子位置:BOTTOMBase Number Matches:1

DF2B6.8SC 数据手册

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DF2B6.8SC  
ESD Protection Diodes Silicon Epitaxial Planar  
DF2B6.8SC  
1. Applications  
ESD Protection  
Note: This product is designed for protection against electrostatic discharge (ESD) and is not intended for any other  
purpose, including, but not limited to, voltage regulation.  
2. Packaging and Internal Circuit  
1: Pin 1  
2: Pin 2  
SC2  
3. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25)  
Characteristics  
Symbol  
Rating  
Unit  
Electrostatic discharge voltage (IEC61000-4-2)(Contact)  
Junction temperature  
VESD  
Tj  
±30  
150  
kV  
Storage temperature  
Tstg  
-55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
2013-08-29  
Rev.1.0  
1

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