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DA82562EZ PDF预览

DA82562EZ

更新时间: 2024-09-16 21:53:27
品牌 Logo 应用领域
英特尔 - INTEL 外围集成电路局域网局域网(LAN)标准
页数 文件大小 规格书
40页 284K
描述
82562EZ 10/100 Mbps Platform LAN Connect (PLC)

DA82562EZ 技术参数

生命周期:Active包装说明:BGA, BGA196,14X14,40
Reach Compliance Code:compliant风险等级:5.77
Is Samacsys:NJESD-30 代码:S-PBGA-B196
端子数量:196封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA196,14X14,40
封装形状:SQUARE封装形式:GRID ARRAY
电源:3.3 V认证状态:Not Qualified
子类别:Serial IO/Communication Controllers标称供电电压:3.3 V
表面贴装:YES端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
uPs/uCs/外围集成电路类型:SERIAL IO/COMMUNICATION CONTROLLER, LANBase Number Matches:1

DA82562EZ 数据手册

 浏览型号DA82562EZ的Datasheet PDF文件第2页浏览型号DA82562EZ的Datasheet PDF文件第3页浏览型号DA82562EZ的Datasheet PDF文件第4页浏览型号DA82562EZ的Datasheet PDF文件第5页浏览型号DA82562EZ的Datasheet PDF文件第6页浏览型号DA82562EZ的Datasheet PDF文件第7页 
82562EZ 10/100 Mbps Platform LAN  
Connect (PLC)  
Networking Silicon  
Datasheet  
Product Features  
IEEE 802.3 10BASE-T/100BASE-TX  
Diagnostic loopback mode  
1:1 transmit transformer ratio support  
compliant physical layer interface  
IEEE 802.3u Auto-Negotiation support  
Digital Adaptive Equalization control  
Link status interrupt capability  
XOR tree mode support  
Low power (less than 300 mW in active  
transmit mode)  
Reduced power in “unplugged mode” (less  
than 50 mW)  
Automatic detection of “unplugged mode”  
3.3 V device  
Thin BGA 15mm2 package  
3-port LED support (speed, link and  
activity)  
10BASE-T auto-polarity correction  
LAN Connect interface  
82540EM layout compatible  
82562EX with Alert on LAN support  
available  
Lead-freea 196-pin Ball Grid Array (BGA).  
(Devices that are lead-free are marked with  
a circled “e1” and have the product code:  
LUxxxxxx.)  
a.This device is lead-free. That is, lead has not been intentionally added, but lead may still exist as an impurity  
at <1000 ppm. The Material Declaration Data Sheet, which includes lead impurity levels and the concentration  
of other Restriction on Hazardous Substances (RoHS)-banned materials, is available at:  
ftp://download.intel.com/design/packtech/material_content_IC_Package.pdf#pagemode=bookmark  
In addition, this device has been tested and conforms to the same parametric specifications as previous versions  
of the device.  
For more information regarding lead-free products from Intel Corporation, contact your Intel Field Sales repre-  
sentative.  
Revision 1.5  
January 2005  

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