CY7C1568KV18/CY7C1570KV18
72-Mbit DDR II+ SRAM Two-Word
Burst Architecture (2.5 Cycle Read Latency)
72-Mbit DDR II+ SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency)
Features
Configurations
■ 72-Mbit density (4M × 18, 2M × 36)
■ 550 MHz clock for high bandwidth
With Read Cycle Latency of 2.5 cycles:
CY7C1568KV18 – 4M × 18
CY7C1570KV18 – 2M × 36
■ Two-word burst for reducing address bus frequency
■ Double data rate (DDR) interfaces (data transferred at
1100 MHz) at 550 MHz
Functional Description
The CY7C1568KV18 and CY7C1570KV18 are 1.8 V
synchronous pipelined SRAMs equipped with DDR II+
architecture. The DDR II+ consists of an SRAM core with
advanced synchronous peripheral circuitry. Addresses for read
and write are latched on alternate rising edges of the input (K)
clock. Write data is registered on the rising edges of both K and
K. Read data is driven on the rising edges of K and K. Each
address location is associated with two 18-bit words
(CY7C1568KV18), or 36-bit words (CY7C1570KV18) that burst
sequentially into or out of the device.
■ Available in 2.5 clock cycle latency
■ Two input clocks (K and K) for precise DDR timing
❐ SRAM uses rising edges only
■ Echo clocks (CQ and CQ) simplify data capture in high speed
systems
■ Data valid pin (QVLD) to indicate valid data on the output
■ Synchronous internally self-timed writes
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need for separately
capturing data from each individual DDR SRAM in the system
design.
■ DDR II+ operates with 2.5 cycle read latency when DOFF is
asserted HIGH
■ Operatessimilarto DDR Idevice with 1 cycle read latencywhen
DOFF is asserted LOW
[1]
■ Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to VDD
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
❐ Supports both 1.5 V and 1.8 V I/O supply
■ HSTL inputs and variable drive HSTL output buffers
■ Available in 165-ball fine pitch ball grid array (FBGA) package
(13 × 15 × 1.4 mm)
For a complete list of related documentation, click here.
■ Offered in both Pb-free and non Pb-free packages
■ JTAG 1149.1 compatible test access port
■ Phase-locked loop (PLL) for accurate data placement
Selection Guide
Description
Maximum operating frequency
550 MHz
550
500 MHz
500
450 MHz
450
400 MHz Unit
400
590
750
MHz
mA
Maximum operating current
× 18
× 36
760
700
650
970
890
820
Note
1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V
= 1.4 V to V
.
DD
DDQ
Cypress Semiconductor Corporation
Document Number: 001-15880 Rev. *R
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised March 11, 2016