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CY7C1545V18-375BZC PDF预览

CY7C1545V18-375BZC

更新时间: 2024-11-20 05:09:39
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
28页 1225K
描述
72-Mbit QDR⑩-II+ SRAM 4-Word Burst Architecture (2.0 Cycle Read Latency)

CY7C1545V18-375BZC 数据手册

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CY7C1541V18  
CY7C1556V18  
CY7C1543V18  
CY7C1545V18  
72-Mbit QDR™-II+ SRAM 4-Word Burst  
Architecture (2.0 Cycle Read Latency)  
Features  
Configurations  
Separate independent read and write data ports  
Supports concurrent transactions  
With Read Cycle Latency of 2.0 cycles:  
CY7C1541V18 – 8M x 8  
300 MHz to 375 MHz clock for high bandwidth  
4-Word burst for reducing address bus frequency  
CY7C1556V18 – 8M x 9  
CY7C1543V18 – 4M x 18  
CY7C1545V18 – 2M x 36  
Double Data Rate (DDR) interfaces on both Read and Write  
Ports (data transferred at 750 MHz) at 375 MHz  
Functional Description  
Available in 2.0 clock cycle latency  
The CY7C1541V18, CY7C1556V18, CY7C1543V18, and  
CY7C1545V18 are 1.8V Synchronous Pipelined SRAMs,  
equipped with QDR-II+ architecture. Similar to QDR-II archi-  
tecture, QDR-II+ SRAMs consists of two separate ports to  
access the memory array. The Read Port has dedicated Data  
Outputs to support read operations and the Write Port has  
dedicated Data Inputs to support write operations. QDR-II+  
architecture has separate data inputs and data outputs to  
completely eliminate the need to “turn-around” the data bus  
required with common IO devices. Access to each port is accom-  
plished through a common address bus. Addresses for read and  
write addresses are latched on alternate rising edges of the input  
(K) clock. Accesses to the QDR-II+ Read and Write Ports are  
completely independent of one another. In order to maximize  
data throughput, both Read and Write Ports are equipped with  
Double Data Rate (DDR) interfaces. Each address location is  
associated with four 8-bit words (CY7C1541V18), 9-bit words  
(CY7C1556V18), 18-bit words (CY7C1543V18), or 36-bit words  
(CY7C1545V18) that burst sequentially into or out of the device.  
Since data can be transferred into and out of the device on every  
rising edge of both input clocks (K and K), memory bandwidth is  
maximized while simplifying system design by eliminating bus  
“turn-arounds”.  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Echo clocks (CQ and CQ) simplify data capture in high speed  
systems  
Data valid pin (QVLD) to indicate valid data on the output  
Single multiplexed address input bus latches address inputs  
for both Read and Write Ports  
Separate Port Selects for depth expansion  
Synchronous internally self-timed writes  
Available in x8, x9, x18, and x36 configurations  
Full data coherency providing most current data  
[1]  
Core VDD = 1.8V ± 0.1V; IO VDDQ = 1.4V to VDD  
HSTL inputs and variable drive HSTL output buffers  
Available in 165-ball FBGA package (15 x 17 x 1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 compatible test access port  
Depth expansion is accomplished with Port Selects for each port.  
Port selects allow each port to operate independently.  
Delay Lock Loop (DLL) for accurate data placement  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
Selection Guide  
375 MHz  
375  
333 MHz  
333  
300 MHz  
300  
Unit  
MHz  
mA  
Maximum Operating Frequency  
Maximum Operating Current  
x8  
x9  
1300  
1300  
1300  
1370  
1200  
1200  
1200  
1230  
1100  
1100  
x18  
x36  
1100  
1140  
Note  
1. The QDR consortium specification for V  
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting  
DDQ  
V
= 1.4V to V  
.
DDQ  
DD  
Cypress Semiconductor Corporation  
Document Number: 001-05389 Rev. *E  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised July 24, 2007  

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