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CY7C1548KV18-450BZC PDF预览

CY7C1548KV18-450BZC

更新时间: 2024-11-20 09:45:07
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器双倍数据速率时钟
页数 文件大小 规格书
31页 927K
描述
72-Mbit DDR II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)

CY7C1548KV18-450BZC 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
针数:165Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.79Is Samacsys:N
最长访问时间:0.45 ns其他特性:PIPELINED ARCHITECTURE
最大时钟频率 (fCLK):450 MHzI/O 类型:COMMON
JESD-30 代码:R-PBGA-B165JESD-609代码:e0
长度:15 mm内存密度:75497472 bit
内存集成电路类型:DDR SRAM内存宽度:18
湿度敏感等级:3功能数量:1
端子数量:165字数:4194304 words
字数代码:4000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:4MX18输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装等效代码:BGA165,11X15,40封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):220电源:1.5/1.8,1.8 V
认证状态:Not Qualified座面最大高度:1.4 mm
最大待机电流:0.34 A最小待机电流:1.7 V
子类别:SRAMs最大压摆率:0.65 mA
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:13 mm
Base Number Matches:1

CY7C1548KV18-450BZC 数据手册

 浏览型号CY7C1548KV18-450BZC的Datasheet PDF文件第2页浏览型号CY7C1548KV18-450BZC的Datasheet PDF文件第3页浏览型号CY7C1548KV18-450BZC的Datasheet PDF文件第4页浏览型号CY7C1548KV18-450BZC的Datasheet PDF文件第5页浏览型号CY7C1548KV18-450BZC的Datasheet PDF文件第6页浏览型号CY7C1548KV18-450BZC的Datasheet PDF文件第7页 
CY7C1546KV18, CY7C1557KV18  
CY7C1548KV18, CY7C1550KV18  
72-Mbit DDR II+ SRAM 2-Word Burst  
Architecture (2.0 Cycle Read Latency)  
72-Mbit DDR II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)  
Features  
Configurations  
72-Mbit density (8 M × 8, 8 M × 9, 4 M × 18, 2 M × 36)  
450-MHz clock for high bandwidth  
With Read Cycle Latency of 2.0 cycles:  
CY7C1546KV18 – 8 M × 8  
CY7C1557KV18 – 8 M × 9  
2-word burst for reducing address bus frequency  
CY7C1548KV18 – 4 M × 18  
CY7C1550KV18 – 2 M × 36  
Double data rate (DDR) interfaces  
(data transferred at 900 MHz) at 450 MHz  
Available in 2.0 clock cycle latency  
Functional Description  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
The CY7C1546KV18, CY7C1557KV18, CY7C1548KV18, and  
CY7C1550KV18 are 1.8 V Synchronous Pipelined SRAMs  
equipped with DDR II+ architecture. The DDR II+ consists of an  
SRAM core with advanced synchronous peripheral circuitry.  
Addresses for read and write are latched on alternate rising  
edges of the input (K) clock. Write data is registered on the rising  
edges of both K and K. Read data is driven on the rising edges  
of K and K. Each address location is associated with two 8-bit  
words (CY7C1546KV18), 9-bit words (CY7C1557KV18), 18-bit  
words (CY7C1548KV18), or 36-bit words (CY7C1550KV18) that  
burst sequentially into or out of the device.  
Echo clocks (CQ and CQ) simplify data capture in high-speed  
systems  
Data valid pin (QVLD) to indicate valid data on the output  
Synchronous internally self-timed writes  
DDR II+ operates with 2.0 cycle read latency when DOFF is  
asserted HIGH  
Operatessimilarto DDR Idevice with 1 cycle read latencywhen  
Asynchronous inputs include an output impedance matching  
input (ZQ). Synchronous data outputs (Q, sharing the same  
physical pins as the data inputs D) are tightly matched to the two  
output echo clocks CQ/CQ, eliminating the need for separately  
capturing data from each individual DDR SRAM in the system  
design.  
DOFF is asserted LOW  
[1]  
Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to VDD  
Supports both 1.5 V and 1.8 V I/O supply  
High-speed transceiver logic (HSTL) inputs and variable drive  
HSTL output buffers  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
Available in 165-ball fine pitch ball grid array (FBGA) package  
(13 ×15 ×1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 compatible test access port  
Phase-Locked Loop (PLL) for accurate Data Placement  
Note  
1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V  
= 1.4 V to V  
.
DDQ  
DD  
Cypress Semiconductor Corporation  
Document Number: 001-15879 Rev. *I  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised January 25, 2011  
[+] Feedback  

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