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CY7C1485V33 PDF预览

CY7C1485V33

更新时间: 2024-09-18 22:24:03
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
29页 508K
描述
2M x 36/4M x 18 Pipelined DCD SRAM

CY7C1485V33 数据手册

 浏览型号CY7C1485V33的Datasheet PDF文件第2页浏览型号CY7C1485V33的Datasheet PDF文件第3页浏览型号CY7C1485V33的Datasheet PDF文件第4页浏览型号CY7C1485V33的Datasheet PDF文件第5页浏览型号CY7C1485V33的Datasheet PDF文件第6页浏览型号CY7C1485V33的Datasheet PDF文件第7页 
CY7C1484V33  
CY7C1485V33  
PRELIMINARY  
2M x 36/4M x 18 Pipelined DCD SRAM  
internal burst operation. All synchronous inputs are gated by  
registers controlled by a positive-edge-triggered Clock Input  
(CLK). The synchronous inputs include all addresses, all data  
inputs, address-pipelining Chip Enable (CE), burst control  
inputs (ADSC, ADSP, and ADV), write enables (BWa, BWb,  
BWc, BWd, and BWE), and Global Write (GW).  
Features  
• Fast clock speed: 250, 200, and 167 MHz  
• Provide high-performance 3-1-1-1 access rate  
• Fast access time: 2.6, 3.0, and 3.4 ns  
• Optimal for depth expansion  
• Single 3.3V –5% and +5% power supply VDD  
• Separate VDDQ for 3.3V or 2.5V  
• Common data inputs and data outputs  
• Byte Write Enable and Global Write control  
• Chip enable for address pipeline  
• Address, data, and control registers  
• Internally self-timed Write Cycle  
Asynchronous inputs include the Output Enable (OE) and  
burst mode control (MODE). The data (DQx) and the data  
parity (DPx) outputs, enabled by OE, are also asynchronous.  
DQa,b,c,d and DPa,b,c,d apply to CY7C1484V33 and DQa,b  
and DPa,b apply to CY7C1485V33. a, b, c, and d each are  
eight bits wide in the case of DQ and one bit wide in the case  
of DP.  
Addresses and chip enables are registered with either  
Address Status Processor (ADSP) or Address Status  
Controller (ADSC) input pins. Subsequent burst addresses  
can be internally generated as controlled by the Burst Advance  
Pin (ADV).  
• Burst control pins (interleaved or linear burst  
sequence)  
• Automatic power-down for portable applications  
• High-density, high-speed packages  
Address, data inputs, and write controls are registered on-chip  
to initiate self-timed Write cycle. Write cycles can be one to  
four bytes wide as controlled by the write control inputs.  
Individual byte write allows individual byte to be written. BWa  
• JTAG boundary scan for BGA packaging version  
• Available in 119-ball bump BGA and 100-pin TQFP  
packages (CY7C1484V33 and CY7C1485V33).  
• 165-ball FBGA will be offered on an opportunity basis.  
(Please contact Cypress sales or marketing)  
controls DQa and DPa. BWb controls DQ and DP . BW  
b
b
controls DQc and DPd. BWd controls DQ and DPd. BWa, BWbc,  
BWc, BWd can be active only with BWE being LOW. GW being  
LOW causes all bytes to be written. Write pass-through  
capability allows written data available at the output for the  
immediately next Read cycle. This device also incorporates  
pipelined enable circuit for easy depth expansion without  
penalizing system performance.  
Functional Description  
The Cypress Synchronous Burst SRAM family employs  
high-speed, low-power CMOS designs using advanced  
single-layer polysilicon, triple-layer metal technology. Each  
memory cell consists of six transistors.  
The CY7C1484V33 and CY7C1485V33 SRAMs integrate  
2,097,152 × 36/4,194,304 × 18 SRAM cells with advanced  
synchronous peripheral circuitry and a two-bit counter for  
The CY7C1484V33/CY7C1485V33 are both double-cycle  
deselect parts.All inputs and outputs of the CY7C1484V33,  
CY7C1485V33 are JEDEC standard JESD8-5-compatible.  
Selection Guide  
CY7C1484V33-  
250  
CY7C1485V33-  
250  
CY7C1484V33-  
200  
CY7C1485V33-  
200  
CY7C1484V33-  
167  
CY7C1485V33-  
167  
Unit  
ns  
Maximum Access Time  
2.6  
3.0  
3.4  
Maximum Operating Current  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
mA  
mA  
Maximum CMOS Standby Current  
Shaded areas contain advance information.  
Cypress Semiconductor Corporation  
Document #: 38-05285 Rev. *A  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised January 18, 2003  

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