CY7C1485V33-167BZC

更新时间： 2024-11-07 22:22:35

品牌	Logo	应用领域
赛普拉斯 - CYPRESS		存储内存集成电路静态存储器时钟
页数	文件大小	规格书
29页	508K
描述
2M x 36/4M x 18 Pipelined DCD SRAM

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

CY7C1485V33-167BZC 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Obsolete	零件包装代码：	BGA
包装说明：	15 X 17 MM, 1.40 MM HEIGHT, FBGA-165	针数：	165
Reach Compliance Code：	compliant	ECCN代码：	3A991.B.2.A
HTS代码：	8542.32.00.41	风险等级：	5.73
Is Samacsys：	N	最长访问时间：	3.4 ns
其他特性：	PIPELINED ARCHITECTURE	最大时钟频率 (fCLK)：	167 MHz
I/O 类型：	COMMON	JESD-30 代码：	R-PBGA-B165
JESD-609代码：	e0	长度：	17 mm
内存密度：	75497472 bit	内存集成电路类型：	CACHE SRAM
内存宽度：	18	湿度敏感等级：	3
功能数量：	1	端子数量：	165
字数：	4194304 words	字数代码：	4000000
工作模式：	SYNCHRONOUS	最高工作温度：	70 °C
最低工作温度：		组织：	4MX18
输出特性：	3-STATE	封装主体材料：	PLASTIC/EPOXY
封装代码：	LBGA	封装等效代码：	BGA165,11X15,40
封装形状：	RECTANGULAR	封装形式：	GRID ARRAY, LOW PROFILE
并行/串行：	PARALLEL	峰值回流温度（摄氏度）：	220
电源：	2.5/3.3,3.3 V	认证状态：	Not Qualified
座面最大高度：	1.4 mm	最小待机电流：	3.14 V
子类别：	SRAMs	最大供电电压 (Vsup)：	3.6 V
最小供电电压 (Vsup)：	3.135 V	标称供电电压 (Vsup)：	3.3 V
表面贴装：	YES	技术：	CMOS
温度等级：	COMMERCIAL	端子面层：	Tin/Lead (Sn/Pb)
端子形式：	BALL	端子节距：	1 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	15 mm	Base Number Matches：	1

CY7C1485V33-167BZC 数据手册

浏览型号CY7C1485V33-167BZC的Datasheet PDF文件第2页

浏览型号CY7C1485V33-167BZC的Datasheet PDF文件第3页

浏览型号CY7C1485V33-167BZC的Datasheet PDF文件第4页

浏览型号CY7C1485V33-167BZC的Datasheet PDF文件第5页

浏览型号CY7C1485V33-167BZC的Datasheet PDF文件第6页

浏览型号CY7C1485V33-167BZC的Datasheet PDF文件第7页

CY7C1484V33

CY7C1485V33

PRELIMINARY

2M x 36/4M x 18 Pipelined DCD SRAM

internal burst operation. All synchronous inputs are gated by

registers controlled by a positive-edge-triggered Clock Input

(CLK). The synchronous inputs include all addresses, all data

inputs, address-pipelining Chip Enable (CE), burst control

inputs (ADSC, ADSP, and ADV), write enables (BW_a, BW_b,

BW_c, BW_d, and BWE), and Global Write (GW).

Features

• Fast clock speed: 250, 200, and 167 MHz

• Provide high-performance 3-1-1-1 access rate

• Fast access time: 2.6, 3.0, and 3.4 ns

• Optimal for depth expansion

• Single 3.3V –5% and +5% power supply V_DD

• Separate V_DDQfor 3.3V or 2.5V

• Common data inputs and data outputs

• Byte Write Enable and Global Write control

• Chip enable for address pipeline

• Address, data, and control registers

• Internally self-timed Write Cycle

Asynchronous inputs include the Output Enable (OE) and

burst mode control (MODE). The data (DQx) and the data

parity (DPx) outputs, enabled by OE, are also asynchronous.

DQa,b,c,d and DPa,b,c,d apply to CY7C1484V33 and DQa,b

and DPa,b apply to CY7C1485V33. a, b, c, and d each are

eight bits wide in the case of DQ and one bit wide in the case

of DP.

Addresses and chip enables are registered with either

Address Status Processor (ADSP) or Address Status

Controller (ADSC) input pins. Subsequent burst addresses

can be internally generated as controlled by the Burst Advance

Pin (ADV).

• Burst control pins (interleaved or linear burst

sequence)

• Automatic power-down for portable applications

• High-density, high-speed packages

Address, data inputs, and write controls are registered on-chip

to initiate self-timed Write cycle. Write cycles can be one to

four bytes wide as controlled by the write control inputs.

Individual byte write allows individual byte to be written. BW_a

• JTAG boundary scan for BGA packaging version

• Available in 119-ball bump BGA and 100-pin TQFP

packages (CY7C1484V33 and CY7C1485V33).

• 165-ball FBGA will be offered on an opportunity basis.

(Please contact Cypress sales or marketing)

controls DQa and DPa. BW_bcontrols DQ and DP . BW

controls DQc and DPd. BW_dcontrols DQ and DPd. BW_a, BW_b^c,

BW_c, BW_dcan be active only with BWE being LOW. GW being

LOW causes all bytes to be written. Write pass-through

capability allows written data available at the output for the

immediately next Read cycle. This device also incorporates

pipelined enable circuit for easy depth expansion without

penalizing system performance.

Functional Description

The Cypress Synchronous Burst SRAM family employs

high-speed, low-power CMOS designs using advanced

single-layer polysilicon, triple-layer metal technology. Each

memory cell consists of six transistors.

The CY7C1484V33 and CY7C1485V33 SRAMs integrate

2,097,152 × 36/4,194,304 × 18 SRAM cells with advanced

synchronous peripheral circuitry and a two-bit counter for

The CY7C1484V33/CY7C1485V33 are both double-cycle

deselect parts.All inputs and outputs of the CY7C1484V33,

CY7C1485V33 are JEDEC standard JESD8-5-compatible.

Selection Guide

CY7C1484V33-

250

CY7C1485V33-

250

CY7C1484V33-

200

CY7C1485V33-

200

CY7C1484V33-

167

CY7C1485V33-

167

Unit

Maximum Access Time

2.6

3.0

3.4

Maximum Operating Current

TBD

Maximum CMOS Standby Current

Shaded areas contain advance information.

Cypress Semiconductor Corporation

Document #: 38-05285 Rev. *A

•

3901 North First Street

•

San Jose, CA 95134

•

408-943-2600

Revised January 18, 2003

12 3 4 5 6 7...29

中文翻译

下载PDF

与CY7C1485V33-167BZC相关器件

型号	品牌	获取价格	描述	数据表
CY7C1485V33-167BZI	CYPRESS	获取价格	72-Mbit (2M x 36/4M x 18) Pipelined DCD Sync SRAM
CY7C1485V33-167BZXC	CYPRESS	获取价格	72-Mbit (2M x 36/4M x 18) Pipelined DCD Sync SRAM
CY7C1485V33-167BZXI	CYPRESS	获取价格	72-Mbit (2M x 36/4M x 18) Pipelined DCD Sync SRAM
CY7C1485V33-200AC	CYPRESS	获取价格	2M x 36/4M x 18 Pipelined DCD SRAM
CY7C1485V33-200AXC	CYPRESS	获取价格	72-Mbit (2M x 36/4M x 18) Pipelined DCD Sync SRAM
CY7C1485V33-200AXI	CYPRESS	获取价格	72-Mbit (2M x 36/4M x 18) Pipelined DCD Sync SRAM
CY7C1485V33-200BGC	CYPRESS	获取价格	2M x 36/4M x 18 Pipelined DCD SRAM
CY7C1485V33-200BZC	CYPRESS	获取价格	2M x 36/4M x 18 Pipelined DCD SRAM
CY7C1485V33-200BZI	CYPRESS	获取价格	72-Mbit (2M x 36/4M x 18) Pipelined DCD Sync SRAM
CY7C1485V33-200BZXC	CYPRESS	获取价格	72-Mbit (2M x 36/4M x 18) Pipelined DCD Sync SRAM

与CY7C1485V33-167BZC相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

19
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

17
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

39
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

37

产品中心

服务支持

精选活动

关于我们

帮助中心

CY7C1485V33-167BZC

CY7C1485V33-167BZC 技术参数

CY7C1485V33-167BZC 数据手册

与CY7C1485V33-167BZC相关器件

与CY7C1485V33-167BZC相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

CY7C1485V33-167BZC

CY7C1485V33-167BZC 技术参数

CY7C1485V33-167BZC 数据手册

与CY7C1485V33-167BZC相关器件

与CY7C1485V33-167BZC相关文章

您还可以找

您在本页遇到什么问题？