是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | 针数: | 165 |
Reach Compliance Code: | unknown | 风险等级: | 5.54 |
最长访问时间: | 0.45 ns | 其他特性: | PIPELINED ARCHITECTURE |
JESD-30 代码: | R-PBGA-B165 | JESD-609代码: | e1 |
长度: | 17 mm | 内存密度: | 37748736 bit |
内存集成电路类型: | QDR SRAM | 内存宽度: | 36 |
湿度敏感等级: | 3 | 功能数量: | 1 |
端子数量: | 165 | 字数: | 1048576 words |
字数代码: | 1000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 1MX36 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, LOW PROFILE | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | 260 | 认证状态: | COMMERCIAL |
座面最大高度: | 1.4 mm | 最大供电电压 (Vsup): | 1.9 V |
最小供电电压 (Vsup): | 1.7 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子面层: | TIN SILVER COPPER | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 20 | 宽度: | 15 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CY7C1414BV18-250BZC | CYPRESS |
获取价格 |
36-Mbit QDR-II SRAM 2-Word Burst Architecture | |
CY7C1414BV18-250BZI | CYPRESS |
获取价格 |
36-Mbit QDR-II SRAM 2-Word Burst Architecture | |
CY7C1414BV18-250BZXC | CYPRESS |
获取价格 |
36-Mbit QDR-II SRAM 2-Word Burst Architecture | |
CY7C1414BV18-250BZXI | CYPRESS |
获取价格 |
36-Mbit QDR-II SRAM 2-Word Burst Architecture | |
CY7C1414JV18 | CYPRESS |
获取价格 |
36-Mbit QDR⑩-II SRAM 2-Word Burst Architectur | |
CY7C1414JV18-250BZC | CYPRESS |
获取价格 |
36-Mbit QDR⑩-II SRAM 2-Word Burst Architectur | |
CY7C1414JV18-250BZI | CYPRESS |
获取价格 |
36-Mbit QDR⑩-II SRAM 2-Word Burst Architectur | |
CY7C1414JV18-250BZXC | CYPRESS |
获取价格 |
36-Mbit QDR⑩-II SRAM 2-Word Burst Architectur | |
CY7C1414JV18-250BZXI | CYPRESS |
获取价格 |
36-Mbit QDR⑩-II SRAM 2-Word Burst Architectur | |
CY7C1414JV18-267BZC | CYPRESS |
获取价格 |
36-Mbit QDR⑩-II SRAM 2-Word Burst Architectur |