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CY7C109D-12VXC PDF预览

CY7C109D-12VXC

更新时间: 2024-11-06 14:48:43
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
9页 244K
描述
Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, LEAD FREE, SOJ-32

CY7C109D-12VXC 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOJ
包装说明:SOJ, SOJ32,.44针数:32
Reach Compliance Code:compliantECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41风险等级:5.73
最长访问时间:12 nsI/O 类型:COMMON
JESD-30 代码:R-PDSO-J32JESD-609代码:e4
长度:20.955 mm内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
湿度敏感等级:3功能数量:1
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:128KX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:SOJ
封装等效代码:SOJ32,.44封装形状:RECTANGULAR
封装形式:SMALL OUTLINE并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:5 V
认证状态:Not Qualified座面最大高度:3.7592 mm
最大待机电流:0.003 A最小待机电流:4.5 V
子类别:SRAMs最大压摆率:0.05 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:J BEND
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40宽度:10.16 mm
Base Number Matches:1

CY7C109D-12VXC 数据手册

 浏览型号CY7C109D-12VXC的Datasheet PDF文件第2页浏览型号CY7C109D-12VXC的Datasheet PDF文件第3页浏览型号CY7C109D-12VXC的Datasheet PDF文件第4页浏览型号CY7C109D-12VXC的Datasheet PDF文件第5页浏览型号CY7C109D-12VXC的Datasheet PDF文件第6页浏览型号CY7C109D-12VXC的Datasheet PDF文件第7页 
CY7C109D  
CY7C1009D  
PRELIMINARY  
1-Mbit (128K x 8) Static RAM  
memory expansion is provided by an active LOW Chip Enable  
(CE1), an active HIGH Chip Enable (CE2), an active LOW  
Output Enable (OE), and tri-state drivers. Writing to the device  
is accomplished by taking Chip Enable One (CE1) and Write  
Enable (WE) inputs LOW and Chip Enable Two (CE2) input  
HIGH. Data on the eight I/O pins (I/O0 through I/O7) is then  
written into the location specified on the address pins (A0  
through A16).  
Features  
• Pin- and function-compatible with  
CY7C109B/CY7C1009B  
• High speed  
— tAA = 10 ns  
• Low active power  
Reading from the device is accomplished by taking Chip  
Enable One (CE1) and Output Enable (OE) LOW while forcing  
Write Enable (WE) and Chip Enable Two (CE2) HIGH. Under  
these conditions, the contents of the memory location  
specified by the address pins will appear on the I/O pins.  
— ICC = 60 mA @ 10 ns  
• Low CMOS standby power  
— ISB2 = 1.2 mA (‘L’ Version only)  
• 2.0V Data Retention  
The eight input/output pins (I/O0 through I/O7) are placed in a  
high-impedance state when the device is deselected (CE1  
HIGH or CE2 LOW), the outputs are disabled (OE HIGH), or  
during a write operation (CE1 LOW, CE2 HIGH, and WE LOW).  
• Automatic power-down when deselected  
• TTL-compatible inputs and outputs  
• Easy memory expansion with CE1, CE2, and OE options  
• Available in Pb-Free Packages  
The CY7C109D is available in standard 400-mil-wide SOJ and  
32-pin TSOP type I packages. The CY7C1009D is available in  
a 300-mil-wide SOJ Pb-Free package. The CY7C1009D and  
CY7C109D are functionally equivalent in all other respects.  
Functional Description[1]  
The CY7C109D/CY7C1009D is a high-performance CMOS  
static RAM organized as 131,072 words by 8 bits. Easy  
Logic Block Diagram  
Pin Configurations  
A11  
A9  
A8  
A13  
WE  
CE2  
A15  
VCC  
NC  
A16  
A14  
A12  
A7  
A6  
A5  
A4  
1
2
32  
31  
OE  
A10  
CE  
I/O7  
I/O6  
I/O5  
I/O4  
I/O3  
GND  
I/O2  
I/O1  
I/O0  
A0  
A1  
A2  
SOJ  
Top View  
3
4
5
6
7
8
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
V
CC  
NC  
32  
1
2
3
4
5
6
7
8
9
10  
A
16  
31  
30  
A
15  
TSOP I  
Top View  
(not to scale)  
A
14  
CE  
2
9
A
12  
29  
28  
WE  
10  
11  
12  
13  
14  
15  
16  
I/O0  
A
7
A
6
A
5
A
13  
INPUT BUFFER  
27  
26  
A
8
A
9
I/O1  
I/O2  
I/O3  
I/O4  
I/O5  
I/O6  
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A3  
25  
24  
23  
22  
21  
A
4
A
3
A
11  
OE  
512 x 256 x 8  
ARRAY  
A
2
A
1
A
10  
109D–2  
CE  
I/O  
7
I/O  
6
11  
12  
13  
1
A7  
A8  
A
0
I/O  
0
20  
19  
I/O  
1
I/O  
5
14  
15  
16  
I/O  
I/O  
I/O  
3
2
18  
17  
4
POWER  
DOWN  
COLUMN  
DECODER  
CE  
CE  
WE  
1
2
GND  
I/O7  
OE  
Selection Guide  
CY7C109D-10  
CY7C1009D-10  
CY7C109D-12  
CY7C1009D-12  
Unit  
ns  
Maximum Access Time  
10  
60  
3
12  
50  
3
Maximum Operating Current  
mA  
Maximum CMOS Standby Current Non-L Com’l / Ind’l  
Low Power Version  
1.2  
1.2  
mA  
Note:  
1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 38-05468 Rev. *C  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised January 10, 2005  

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