CY7C1021DV33
1-Mbit (64K x 16) Static RAM
Features
Functional Description[1]
• Temperature Ranges
The CY7C1021DV33 is a high-performance CMOS static
RAM organized as 65,536 words by 16 bits. This device has
an automatic power-down feature that significantly reduces
power consumption when deselected.
— Industrial: –40°C to 85°C
— Automotive-A: –40°C to 85°C
— Automotive-E: –40°C to 125°C
• Pin-and function-compatible with CY7C1021CV33
• High speed
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is
written into the location specified on the address pins (A0
through A15). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O8 through I/O15) is written into the location
specified on the address pins (A0 through A15).
— tAA = 10 ns
• Low active power
— ICC = 60 mA @ 10 ns
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O8 to I/O15. See
the truth table at the end of this data sheet for a complete
description of Read and Write modes.
• Low CMOS standby power
— ISB2 = 3 mA
• 2.0V data retention
• Automatic power-down when deselected
• CMOS for optimum speed/power
• Independent control of upper and lower bits
• Available in Pb-free 44-pin 400-Mil wide Molded SOJ,
44-pin TSOP II and 48-ball VFBGA packages
The input/output pins (I/O0 through I/O15) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a Write operation
(CE LOW, and WE LOW).
The CY7C1021DV33 is available in Pb-free 44-pin 400-Mil
wide Molded SOJ, 44-pin TSOP II and 48-ball VFBGA
packages.
Logic Block Diagram
DATA IN DRIVERS
A7
A6
A5
64K x 16
A4
I/O0–I/O7
RAM Array
A3
A2
A1
A0
I/O8–I/O15
COLUMN DECODER
BHE
WE
CE
OE
BLE
Note
1. For guidelines on SRAM system design, please refer to the “System Design Guidelines” Cypress application note, available on the internet at www.cypress.com
Cypress Semiconductor Corporation
Document #: 38-05460 Rev. *F
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised December 14, 2010
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