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CY7C1019CV33-12BVXI PDF预览

CY7C1019CV33-12BVXI

更新时间: 2024-01-17 14:00:09
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
10页 381K
描述
128K x 8 Static RAM

CY7C1019CV33-12BVXI 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:LEAD FREE, TSOP2-32
针数:32Reach Compliance Code:unknown
ECCN代码:3A991.B.2.BHTS代码:8542.32.00.41
风险等级:5.46最长访问时间:12 ns
JESD-30 代码:R-PDSO-G32JESD-609代码:e3
长度:20.95 mm内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
湿度敏感等级:3功能数量:1
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:128KX8封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.63 V最小供电电压 (Vsup):2.97 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
宽度:10.16 mmBase Number Matches:1

CY7C1019CV33-12BVXI 数据手册

 浏览型号CY7C1019CV33-12BVXI的Datasheet PDF文件第2页浏览型号CY7C1019CV33-12BVXI的Datasheet PDF文件第3页浏览型号CY7C1019CV33-12BVXI的Datasheet PDF文件第4页浏览型号CY7C1019CV33-12BVXI的Datasheet PDF文件第5页浏览型号CY7C1019CV33-12BVXI的Datasheet PDF文件第6页浏览型号CY7C1019CV33-12BVXI的Datasheet PDF文件第7页 
CY7C1019CV33  
128K x 8 Static RAM  
device has an automatic power-down feature that significantly  
reduces power consumption when deselected.  
Features  
• Pin and function compatible with CY7C1019BV33  
• High speed  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. Data on the eight I/O  
pins (I/O0 through I/O7) is then written into the location  
specified on the address pins (A0 through A16).  
— tAA = 10 ns  
• CMOS for optimum speed/power  
• Data retention at 2.0V  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing Write  
Enable (WE) HIGH. Under these conditions, the contents of  
the memory location specified by the address pins will appear  
on the I/O pins.  
• Center power/ground pinout  
• Automatic power-down when deselected  
• Easy memory expansion with CE and OE options  
The eight input/output pins (I/O0 through I/O7) are placed in a  
high-impedance state when the device is deselected (CE  
HIGH), the outputs are disabled (OE HIGH), or during a write  
operation (CE LOW, and WE LOW).  
• Available in Pb-free and non Pb-free 48-ball VFBGA,  
32-pin TSOP II and 400-mil SOJ package  
Functional Description  
The CY7C1019CV33 is available in Standard 48-ball FBGA,  
32-pin TSOP II and 400-mil-wide SOJ packages  
The CY7C1019CV33 is a high-performance CMOS static  
RAM organized as 131,072 words by 8 bits. Easy memory  
expansion is provided by an active LOW Chip Enable (CE), an  
active LOW Output Enable (OE), and tri-state drivers. This  
Logic Block Diagram  
Pin Configuration  
SOJ/TSOP II  
Top View  
A
A
1
A
A
32  
1
0
16  
31  
30  
2
3
4
5
6
15  
A
A
14  
A
13  
2
I/O  
A
29  
28  
3
0
INPUT BUFFER  
CE  
OE  
I/O  
I/O  
I/O  
27  
26  
1
I/O  
A
0
0
1
7
A
A
2
1
I/O  
V
7
8
9
10  
11  
12  
13  
6
I/O  
2
25  
24  
23  
22  
21  
V
CC  
SS  
A
3
V
A
I/O  
V
CC  
I/O  
4
SS  
128K x 8  
ARRAY  
3
A
5
I/O  
I/O  
2
3
5
4
A
6
I/O  
I/O  
A
4
A
7
A
8
WE  
A
4
12  
I/O  
A
11  
5
20  
19  
A
5
A
10  
14  
15  
16  
I/O  
6
POWER  
DOWN  
A
6
A
9
A
8
COLUMN  
DECODER  
18  
17  
CE  
A
7
I/O  
WE  
7
OE  
Cypress Semiconductor Corporation  
Document #: 38-05130 Rev. *F  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised August 3, 2006  
[+] Feedback  

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