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CY7C1011DV33-10ZSXIT PDF预览

CY7C1011DV33-10ZSXIT

更新时间: 2024-11-08 14:53:51
品牌 Logo 应用领域
英飞凌 - INFINEON 静态存储器
页数 文件大小 规格书
17页 499K
描述
Asynchronous SRAM

CY7C1011DV33-10ZSXIT 数据手册

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CY7C1011DV33  
2-Mbit (128 K × 16) Static RAM  
2-Mbit (128  
K × 16) Static RAM  
Features  
Functional Description  
Pin-and function-compatible with CY7C1011CV33  
The CY7C1011DV33[1] is a high-performance CMOS Static  
RAM organized as 128 K words by 16 bits.  
High speed  
tAA = 10 ns  
Writing to the device is accomplished by taking Chip Enable (CE)  
and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is  
LOW, then data from I/O pins (I/O0 through I/O7), is written into  
the location specified on the address pins (A0 through A16). If  
Byte High Enable (BHE) is LOW, then data from I/O pins (I/O8  
through I/O15) is written into the location specified on the address  
pins (A0 through A16).  
Low active power  
ICC = 90 mA @ 10 ns (Industrial)  
Low CMOS standby power  
ISB2 = 10 mA  
Data Retention at 2.0 V  
Reading from the device is accomplished by taking Chip Enable  
(CE) and Output Enable (OE) LOW while forcing the Write  
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data  
from the memory location specified by the address pins will  
appear on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then  
data from memory will appear on I/O8 to I/O15. See the truth table  
at the back of this data sheet for a complete description of read  
and write modes.  
Automatic power-down when deselected  
Independent control of upper and lower bits  
Easy memory expansion with CE and OE features  
Available in Pb-free 44-pin TSOP II, and 48-ball VFBGA  
The input/output pins (I/O0 through I/O15) are placed in a  
high-impedance state when the device is deselected (CE HIGH),  
the outputs are disabled (OE HIGH), the BHE and BLE are  
disabled (BHE, BLE HIGH), or during a write operation (CE LOW,  
and WE LOW).  
The CY7C1011DV33 is available in standard Pb-free 44-pin  
TSOP II with center power and ground pinout, as well as 48-ball  
very fine-pitch ball grid array (VFBGA) packages.  
For a complete list of related resources, click here.  
Logic Block Diagram  
INPUT BUFFER  
A
0
A
1
A
2
I/O0–I/O7  
A
3
A
4
128K X 16  
I/O8–I/O15  
A
6
5
A
A
7
A
8
COLUMN  
DECODER  
BHE  
WE  
CE  
OE  
BLE  
Note  
1. For guidelines on SRAM system design, please refer to the “System Design Guidelines” Cypress application note, available on the internet at www.cypress.com  
Cypress Semiconductor Corporation  
Document Number: 38-05609 Rev. *H  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised November 12, 2014  

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