CY62177DV30
MoBL®
32-Mbit (2M x 16) Static RAM
reduces power consumption. The device can also be put into
standby mode when deselected (CE1 HIGH or CE2 LOW or
both BHE and BLE are HIGH). The input/output pins (I/O0
through I/O15) are placed in a high-impedance state when:
deselected (CE1HIGH or CE2 LOW), outputs are disabled (OE
HIGH), both Byte High Enable and Byte Low Enable are
disabled (BHE, BLE HIGH), or during a write operation (CE1
LOW, CE2 HIGH and WE LOW).
Features
• Very high speed: 55 ns and 70 ns
• Wide voltage range: 2.20V–3.60V
• Ultra-low active power
— Typical active current: 2 mA @ f = 1 MHz
— Typical active current: 15 mA @ f = fmax
• Ultra low standby power
Writing to the device is accomplished by taking Chip Enables
(CE1 LOW and CE2 HIGH) and Write Enable (WE) input LOW.
If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0
through I/O7), is written into the location specified on the
address pins (A0 through A20). If Byte High Enable (BHE) is
LOW, then data from I/O pins (I/O8 through I/O15) is written into
the location specified on the address pins (A0 through A20).
• Easy memory expansion with CE1, CE2 and OE features
• Automatic power-down when deselected
• CMOS for optimum speed/power
• Packages offered in a 48-ball FBGA
Reading from the device is accomplished by taking Chip
Enables (CE1 LOW and CE2 HIGH) and Output Enable (OE)
LOW while forcing the Write Enable (WE) HIGH. If Byte Low
Enable (BLE) is LOW, then data from the memory location
specified by the address pins will appear on I/O0 to I/O7. If Byte
High Enable (BHE) is LOW, then data from memory will appear
on I/O8 to I/O15. See the truth table for a complete description
of read and write modes.
Functional Description[1]
The CY62177DV30 is a high-performance CMOS static RAM
organized as 2M words by 16 bits. This device features
advanced circuit design to provide ultra-low active current.
This is ideal for providing More Battery Life™ (MoBL®) in
portable applications such as cellular telephones.The device
also has an automatic power-down feature that significantly
Logic Block Diagram
DATA-IN DRIVERS
A10
A 9
A 8
A 7
A 6
A 5
A 4
A 3
2048K × 16
RAM Array
I/O0–I/O7
I/O8–I/O15
A 2
A 1
A 0
COLUMN DECODER
BHE
WE
CE2
CE
1
OE
BLE
Power-down
Circuit
Note:
1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05633 Rev. *C
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised June 14, 2006
[+] Feedback