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CY62167G30-55BVXET PDF预览

CY62167G30-55BVXET

更新时间: 2023-09-03 20:30:57
品牌 Logo 应用领域
英飞凌 - INFINEON 静态存储器
页数 文件大小 规格书
19页 519K
描述
Asynchronous SRAM

CY62167G30-55BVXET 数据手册

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CY62167G Automotive  
16-Mbit (1M Words × 16-Bit) Static RAM  
with Error-Correcting Code (ECC)  
16-Mbit (1M Words  
× 16-Bit) Static RAM with Error-Correcting Code (ECC)  
Data writes are performed by asserting the Write Enable input  
(WE) LOW, and providing the data and address on device data  
(I/O0 through I/O15) and address (A0 through A19) pins  
respectively. The Byte High/Low Enable (BHE, BLE) inputs  
control byte writes, and write data on the corresponding I/O lines  
Features  
AEC-Q100 qualified  
Ultra-low standby power  
Typical standby current: 5.5 A  
Maximum standby current: 75 A  
to the memory location specified. BHE controls I/O8 through  
I/O15; BLE controls I/O0 through I/O7.  
High speed: 45 ns / 55 ns  
Data reads are performed by asserting the Output Enable (OE)  
input and providing the required address on the address lines.  
Read data is accessible on I/O lines (I/O0 through I/O15). Byte  
accesses can be performed by asserting the required byte  
enable signal (BHE, BLE) to read either the upper byte or the  
lower byte of data from the specified address location.  
Embedded error-correcting code (ECC) for single-bit error  
correction  
Temperature Ranges:  
Automotive-A: -40 C to +85 C  
Automotive-E: -40 C to +125 C  
All I/Os (I/O0 through I/O15) are placed in a HI-Z state when the  
device is deselected (CE1 HIGH / CE2 LOW for dual chip-enable  
Operating voltage range: 2.2 V to 3.6 V  
1.0-V data retention  
device), or control signals are de-asserted (OE, BLE, and BHE).  
These devices also have a unique “Byte Power down” feature  
TTL-compatible inputs and outputs  
where if both the Byte Enables (BHE and BLE) are disabled, the  
devices seamlessly switches to standby mode irrespective of the  
state of the chip enable(s), thereby saving power.  
Available in Pb-free 48-ball VFBGA and 48-pin TSOP I  
packages  
The CY62167G device is available in a Pb-free 48-ball VFBGA  
and 48-pin TSOP I packages. The device in the 48-pin TSOP I  
package can also be configured to function as a 2M words × 8  
bit device.The logic block diagram is on page 2. Refer to Pin  
Configurations on page 4 and the associated footnotes for  
details.  
Functional Description  
CY62167G is high-performance CMOS low-power (MoBL)  
SRAM devices with embedded ECC. This device is offered in  
dual chip-enable.  
Devices with dual chip-enable are accessed by asserting both  
chip-enable inputs – CE1 as LOW and CE2 as HIGH.  
Note  
1. This device does not support automatic write-back on error detection.  
Cypress Semiconductor Corporation  
Document Number: 001-84902 Rev. *F  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised May 3, 2017  

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