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CRG03(T5L,MAT-PA,Q

更新时间： 2024-11-08 06:09:11
品牌 Logo 应用领域
东芝 - TOSHIBA 二极管
页数 文件大小 规格书
4页 171K
描述
Rectifier Diode

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中文翻译

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CRG03(T5L,MAT-PA,Q 技术参数

生命周期：ActiveReach Compliance Code：unknown
风险等级：5.72二极管类型：RECTIFIER DIODE
Base Number Matches：1

CRG03(T5L,MAT-PA,Q 数据手册

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CRG03  
TOSHIBA Rectifier Silicon Diffused Type  
CRG03  
Unit: mm  
General Purpose Rectifier Applications  
•
•
•
Average forward current: I  
= 1.0 A  
F (AV)  
Repetitive peak reverse voltage: V  
= 400 V  
RRM  
Suitable for compact assembly due to small surface-mount package  
“S−FLATTM” (Toshiba package name)  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Symbol  
Rating  
Unit  
Repetitive Peak Reverse Voltage  
Average Forward Current  
V
400  
V
A
RRM  
I
1.0（Note）  
15.0 (50Hz)  
F (AV)  
Peak One Cycle Surge Forward  
Current (Non−Repetitive)  
I
A
FSM  
16.5 (60Hz)  
−40~150  
Junction Temperature  
T
°C  
°C  
j
Storage Temperature Range  
T
−40~150  
stg  
JEDEC  
JEITA  
―
―
Note: 1 Ta = 56°C  
Device mounted on a ceramic board  
board size: 50 mm × 50 mm  
soldering land: 2 mm × 2 mm  
board thickness 0.64t  
TOSHIBA  
3-2A1A  
Weight: 0.013 g (typ.)  
Note 2: Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to  
decrease in the reliability significantly even if the operating conditions (i.e. operating  
temperature/current/voltage, etc.) are within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
= 0.1 A (Pulse test)  
Min  
Typ.  
Max  
Unit  
V
FM(1)  
V
FM(2)  
V
FM(3)  
I
RRM  
I
I
I
⎯
⎯
⎯
⎯
0.86  
0.97  
1.0  
⎯
1.1  
⎯
V
V
FM  
FM  
FM  
Peak forward voltage  
= 0.7 A (Pulse test)  
= 1.0 A (Pulse test)  
V
Repetitive peak reverse current  
V
= 400 V (Pulse test)  
⎯
10  
μA  
RRM  
Device mounted on a ceramic board  
Board size: 50 mm × 50 mm  
Soldering land: 2 mm × 2 mm  
Board thickness: 0.64t  
⎯
⎯
65  
R
th (j-a)  
°C/W  
Device mounted on a glass-epoxy  
board  
Thermal resistance  
Board size: 50 mm × 50 mm  
Soldering land: 6 mm × 6 mm  
Board thickness: 1.6t  
⎯
⎯
⎯
⎯
130  
20  
R
th (j-ℓ)  
―
°C/W  
Start of commercial production  
2003-07  
2013-11-01  
1
1234

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