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CPD06_10 PDF预览

CPD06_10

更新时间: 2024-10-14 09:30:19
品牌 Logo 应用领域
CENTRAL /
页数 文件大小 规格书
2页 393K
描述
General Purpose Rectifier 3 Amp Glass Passivated Rectifier Chip

CPD06_10 数据手册

 浏览型号CPD06_10的Datasheet PDF文件第2页 
PROCESS CPD06  
General Purpose Rectifier  
3 Amp Glass Passivated Rectifier Chip  
PROCESS DETAILS  
Process  
GLASS PASSIVATED MESA  
Die Size  
89 x 89 MILS  
Die Thickness  
10.2 MILS  
Anode Bonding Pad Area  
Top Side Metalization  
Back Side Metalization  
66 x 66 MILS  
Ni/Au - 5,000Å/2,000Å  
Ni/Au - 5,000Å/2,000Å  
GEOMETRY  
GROSS DIE PER 4 INCH WAFER  
1,490  
PRINCIPAL DEVICE TYPES  
1N5400 thru 1N5408  
1N5550 thru 1N5554  
1N5624 thru 1N5627  
CMR3-02 Series  
BACKSIDE CATHODE  
R4 (22-March 2010)  
www.centralsemi.com  

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