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CP3BT26G18NEPX/NOPB PDF预览

CP3BT26G18NEPX/NOPB

更新时间： 2024-02-15 02:09:02
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德州仪器 - TI 微控制器外围集成电路
页数 文件大小 规格书
374页 6760K
描述
Reprogrammable Connectivity Processor with Bluetooth, USB, and CAN Interfaces 128-LQFP

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CP3BT26G18NEPX/NOPB 技术参数

是否Rohs认证： 符合生命周期：Obsolete
Reach Compliance Code：compliant风险等级：5.83
位大小：16CPU系列：CR16C
JESD-30 代码：R-PQFP-G128JESD-609代码：e3
湿度敏感等级：3端子数量：128
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：QFP
封装等效代码：QFP128,.63X.87,20封装形状：RECTANGULAR
封装形式：FLATPACK电源：2.5,2.5/3.3 V
认证状态：Not QualifiedRAM（字节）：32768
ROM（单词）：262144ROM可编程性：FLASH
速度：24 MHz子类别：Microcontrollers
最大压摆率：20 mA表面贴装：YES
温度等级：INDUSTRIAL端子面层：Matte Tin (Sn)
端子形式：GULL WING端子节距：0.5 mm
端子位置：QUADBase Number Matches：1

CP3BT26G18NEPX/NOPB 数据手册

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CP3BT26  
www.ti.com  
SNOSAE5D –FEBRUARY 2007–REVISED DECEMBER 2013  
®
CP3BT26 Reprogrammable Connectivity Processor with Bluetooth , USB, and CAN  
Interfaces  
Check for Samples: CP3BT26  
1 GENERAL DESCRIPTION  
The CP3BT26 connectivity processor combines high performance with the massive integration needed for  
embedded Bluetooth applications. A powerful RISC core with on-chip SRAM and Flash memory provides  
high computing bandwidth, hardware communications peripherals provide high- I/O bandwidth, and an  
external bus provides system expandability.  
On-chip communications peripherals include: Bluetooth Lower Link Controller, Universal Serial Bus (USB)  
1.1 node, CAN, Microwire/Plus, SPI, ACCESS.bus, quad UART, 12-bit A/D converter, and Advanced  
Audio Interface (AAI). Additional on-chip peripherals include Random Number Generator (RNG), DMA  
controller, CVSD/PCM conversion module, Timing and Watchdog Unit, Versatile Timer Unit, Multi-Function  
Timer, and Multi-Input Wake-Up (MIWU) unit.  
Bluetooth hand-held devices can be both smaller and lower in cost for maximum consumer appeal. The  
low voltage and advanced power-saving modes achieve new design points in the trade-off between  
battery size and operating time for handheld and portable applications.  
In addition to providing the features needed for the next generation of embedded Bluetooth products, the  
CP3BT26 is backed up by the software resources designers need for rapid time-to-market, including an  
operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an  
integrated development environment. Combined with a Bluetooth radio transceiver such as TI’s LMX5252,  
the CP3BT26 provides a complete Bluetooth system solution.  
Texas Instruments offers a complete and industry-proven application development environment for  
CP3BT26 applications, including the IAR Embedded Workbench, iSYSTEM winIDEA and iC3000 Active  
Emulator, Bluetooth Development Board, Bluetooth Protocol Stack, and Application Software.  
Figure 1-1. Block Diagram  
1
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date. Products conform to  
Copyright © 2007–2013, Texas Instruments Incorporated  
specifications per the terms of the Texas Instruments standard warranty. Production  
processing does not necessarily include testing of all parameters.  
 
 
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