CP3SP33SMS

更新时间： 2024-02-23 16:00:46

品牌	Logo	应用领域
美国国家半导体 - NSC		微控制器和处理器蓝牙
页数	文件大小	规格书
6页	149K
描述
CP3SP33 Connectivity Processor with Cache, DSP, and Bluetooth, USB, and Dual CAN Interfaces

阅读下载

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

CP3SP33SMS 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
Reach Compliance Code：	unknown	风险等级：	5.82
Is Samacsys：	N	JESD-609代码：	e1
湿度敏感等级：	3	端子面层：	Tin/Silver/Copper (Sn/Ag/Cu)
Base Number Matches：	1

CP3SP33SMS 数据手册

PRELIMINARY

September 2005

CP3SP33 Connectivity Processor with Cache, DSP, and

Bluetooth^®, USB, and Dual CAN Interfaces

1.0 General Description

The CP3SP33 connectivity processor combines high per- In addition to providing the features needed for the next gen-

formance with the massive integration needed for embed- eration of embedded Bluetooth products, the CP3SP33 is

ded Bluetooth applications. A powerful RISC core with 4K- backed up by the software resources that designers need

byte instruction cache and a Teak^®DSP coprocessor pro- for rapid time-to-market, including an operating system,

vides high computing bandwidth, DMA-driven hardware Bluetooth protocol stack implementation, peripheral drivers,

communications peripherals provide high I/O bandwidth, reference designs, and an integrated development environ-

and an external bus provides system expandability.

ment. Combined with an external program memory and a

Bluetooth radio transceiver such as National’s LMX5252,

the CP3SP33 provides a complete Bluetooth system solu-

tion.

On-chip communications peripherals include: Bluetooth

Lower Link Controller, Universal Serial Bus (2.0) OTG node

and host controller, dual CAN, dual Microwire/Plus/SPI,

dual ACCESS.bus, quad UART, 10-bit A/D converter, and National Semiconductor offers a complete and industry-

telematics/audio codec. Additional on-chip peripherals in- proven application development environment for CP3SP33

clude DMA controller, dual CVSD/PCM conversion module, applications, including the IAR Embedded Workbench,

I²S and AAI digital audio bus interfaces, Timing and Watch- iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth

dog Unit, dual Versatile Timer Unit, dual Multi-Function Tim- Development Board, Bluetooth protocol stack, and applica-

er, and Multi-Input Wake-Up (MIWU) unit.

tion examples.

Block Diagram

Bluetooth is a registered trademark of Bluetooth SIG, Inc. and is used under license by National Semiconductor. Teak is a registered trademark of ParthusCeva, Inc.

TRI-STATE is a registered trademark of National Semiconductor Corporation.

www.national.com

12 3 4 5 6

下载PDF

与CP3SP33SMS相关器件

型号	品牌	描述	获取价格	数据表
CP3UB17	NSC	CP3UB17 Reprogrammable Connectivity Processor with USB Interface	获取价格
CP3UB17G38	NSC	CP3UB17 Reprogrammable Connectivity Processor with USB Interface	获取价格
CP3UB17G38/NOPB	TI	IC,MICROCONTROLLER,16-BIT,CR16C CPU,QFP,100PIN,PLASTIC	获取价格
CP3UB17G38X/NOPB	TI	IC,MICROCONTROLLER,16-BIT,CR16C CPU,QFP,100PIN,PLASTIC	获取价格
CP3UB17K38	NSC	CP3UB17 Reprogrammable Connectivity Processor with USB Interface	获取价格
CP3UB17K38/NOPB	TI	Reprogrammable Connectivity Processor with USB Interface 48-PLGA -40 to 85	获取价格