Datasheet > CP3SP33SMRX/NOPB

CP3SP33SMRX/NOPB

更新时间： 2024-01-18 14:15:17

品牌	Logo	应用领域
德州仪器 - TI		微控制器外围集成电路
页数	文件大小	规格书
6页	192K
描述
Processor with Cache, DSP,Bluetooth, USB, Dual CAN Interface 144-NFBGA -40 to 85

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CP3SP33SMRX/NOPB 技术参数

是否无铅：	含铅	是否Rohs认证：	符合
生命周期：	Obsolete	零件包装代码：	BGA
包装说明：	LFBGA, BGA144,12X12,32	针数：	144
Reach Compliance Code：	compliant	HTS代码：	8542.31.00.01
风险等级：	5.6	Is Samacsys：	N
位大小：	16	CPU系列：	CR16C
JESD-30 代码：	S-PBGA-B144	JESD-609代码：	e1
长度：	10 mm	湿度敏感等级：	3
端子数量：	144	最高工作温度：	85 °C
最低工作温度：	-40 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	LFBGA	封装等效代码：	BGA144,12X12,32
封装形状：	SQUARE	封装形式：	GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）：	260	电源：	1.8 V
认证状态：	Not Qualified	RAM（字节）：	32768
ROM（单词）：	0	座面最大高度：	1.4 mm
速度：	96 MHz	子类别：	Microcontrollers
最大压摆率：	200 mA	最大供电电压：	1.98 V
最小供电电压：	1.62 V	标称供电电压：	1.8 V
表面贴装：	YES	技术：	CMOS
温度等级：	INDUSTRIAL	端子面层：	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：	BALL	端子节距：	0.8 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	10 mm	uPs/uCs/外围集成电路类型：	MICROPROCESSOR CIRCUIT
Base Number Matches：	1

CP3SP33SMRX/NOPB 数据手册

PRELIMINARY

September 2005

CP3SP33 Connectivity Processor with Cache, DSP, and

Bluetooth^®, USB, and Dual CAN Interfaces

1.0 General Description

The CP3SP33 connectivity processor combines high per- In addition to providing the features needed for the next gen-

formance with the massive integration needed for embed- eration of embedded Bluetooth products, the CP3SP33 is

ded Bluetooth applications. A powerful RISC core with 4K- backed up by the software resources that designers need

byte instruction cache and a Teak^®DSP coprocessor pro- for rapid time-to-market, including an operating system,

vides high computing bandwidth, DMA-driven hardware Bluetooth protocol stack implementation, peripheral drivers,

communications peripherals provide high I/O bandwidth, reference designs, and an integrated development environ-

and an external bus provides system expandability.

ment. Combined with an external program memory and a

Bluetooth radio transceiver such as National’s LMX5252,

the CP3SP33 provides a complete Bluetooth system solu-

tion.

On-chip communications peripherals include: Bluetooth

Lower Link Controller, Universal Serial Bus (2.0) OTG node

and host controller, dual CAN, dual Microwire/Plus/SPI,

dual ACCESS.bus, quad UART, 10-bit A/D converter, and National Semiconductor offers a complete and industry-

telematics/audio codec. Additional on-chip peripherals in- proven application development environment for CP3SP33

clude DMA controller, dual CVSD/PCM conversion module, applications, including the IAR Embedded Workbench,

I²S and AAI digital audio bus interfaces, Timing and Watch- iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth

dog Unit, dual Versatile Timer Unit, dual Multi-Function Tim- Development Board, Bluetooth protocol stack, and applica-

er, and Multi-Input Wake-Up (MIWU) unit.

tion examples.

Block Diagram

Bluetooth is a registered trademark of Bluetooth SIG, Inc. and is used under license by National Semiconductor. Teak is a registered trademark of ParthusCeva, Inc.

TRI-STATE is a registered trademark of National Semiconductor Corporation.

www.national.com

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与CP3SP33SMRX/NOPB相关器件

型号	品牌	描述	获取价格	数据表
CP3SP33SMS	NSC	CP3SP33 Connectivity Processor with Cache, DSP, and Bluetooth, USB, and Dual CAN Interface	获取价格
CP3UB17	NSC	CP3UB17 Reprogrammable Connectivity Processor with USB Interface	获取价格
CP3UB17G38	NSC	CP3UB17 Reprogrammable Connectivity Processor with USB Interface	获取价格
CP3UB17G38/NOPB	TI	IC,MICROCONTROLLER,16-BIT,CR16C CPU,QFP,100PIN,PLASTIC	获取价格
CP3UB17G38X/NOPB	TI	IC,MICROCONTROLLER,16-BIT,CR16C CPU,QFP,100PIN,PLASTIC	获取价格
CP3UB17K38	NSC	CP3UB17 Reprogrammable Connectivity Processor with USB Interface	获取价格

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