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CMLDM8005BK PDF预览

CMLDM8005BK

更新时间: 2024-11-11 19:52:23
品牌 Logo 应用领域
CENTRAL /
页数 文件大小 规格书
3页 1029K
描述
Transistor

CMLDM8005BK 技术参数

是否Rohs认证: 不符合生命周期:Active
Reach Compliance Code:unknown风险等级:5.69
最大漏极电流 (Abs) (ID):0.65 AFET 技术:METAL-OXIDE SEMICONDUCTOR
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):0.35 W
子类别:Other Transistors表面贴装:YES
Base Number Matches:1

CMLDM8005BK 数据手册

 浏览型号CMLDM8005BK的Datasheet PDF文件第2页浏览型号CMLDM8005BK的Datasheet PDF文件第3页 
CMLDM8005  
SURFACE MOUNT SILICON  
DUAL P-CHANNEL  
ENHANCEMENT-MODE  
MOSFET  
www.centralsemi.com  
DESCRIPTION:  
The CENTRAL SEMICONDUCTOR CMLDM8005  
consists of dual P-Channel enhancement-mode silicon  
MOSFETs designed for high speed pulsed amplifier  
and driver applications. These MOSFETs offer very low  
r
and low threshold voltage.  
DS(ON)  
MARKING CODE: CC8  
FEATURES:  
• ESD protection up to 1800V (Human Body Model)  
• 350mW power dissipation  
SOT-563 CASE  
• Very low r  
• Low threshold voltage  
• Logic level compatible  
DS(ON)  
APPLICATIONS:  
• Load switch/Level shifting  
• Battery charging  
• Small, SOT-563 surface mount package  
• Complementary dual N-Channel device: CMLDM7005  
• Boost switch  
• Electro-luminescent backlighting  
MAXIMUM RATINGS: (T =25°C)  
Drain-Source Voltage  
SYMBOL  
UNITS  
V
A
V
20  
8.0  
DS  
Gate-Source Voltage  
V
V
mA  
mA  
A
GS  
Continuous Drain Current (Steady State - Note 1)  
Continuous Source Current (Body Diode)  
Maximum Pulsed Drain Current  
Power Dissipation (Note 1)  
I
650  
D
I
250  
S
I
1.0  
DM  
P
P
P
350  
mW  
mW  
mW  
°C  
D
D
D
Power Dissipation (Note 2)  
300  
Power Dissipation (Note 2)  
150  
Operating and Storage Junction Temperature  
Thermal Resistance (Note 1)  
T , T  
-65 to +150  
357  
J
stg  
Θ
°C/W  
JA  
ELECTRICAL CHARACTERISTICS PER TRANSISTOR: (T =25°C unless otherwise noted)  
A
SYMBOL  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
I
, I  
V
V
V
V
V
V
V
V
=4.5V, V =0  
10  
μA  
GSSF GSSR  
GS  
DS  
GS  
DS  
I
=16V, V =0  
GS  
100  
nA  
V
DSS  
BV  
=0, I =250μA  
20  
DSS  
GS(th)  
SD  
D
V
V
=V , I =250μA  
0.5  
1.0  
1.1  
V
DS GS  
D
=0, I =250mA  
V
GS  
GS  
GS  
GS  
S
r
r
r
=4.5V, I =350mA  
0.25  
0.37  
0.36  
0.5  
Ω
Ω
Ω
DS(ON)  
DS(ON)  
DS(ON)  
D
=2.5V, I =300mA  
D
=1.8V, I =150mA  
0.8  
D
Notes: (1) Ceramic or aluminum core PC Board with copper mounting pad area of 4.0mm2  
(2) FR-4 Epoxy PC Board with copper mounting pad area of 4.0mm2  
(3) FR-4 Epoxy PC Board with copper mounting pad area of 1.4mm2  
R4 (5-June 2013)  

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