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CMLDM8120TGTRPBFREE PDF预览

CMLDM8120TGTRPBFREE

更新时间: 2024-11-11 13:06:55
品牌 Logo 应用领域
CENTRAL 晶体小信号场效应晶体管
页数 文件大小 规格书
2页 511K
描述
Transistor,

CMLDM8120TGTRPBFREE 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliant风险等级:5.61
配置:Single最大漏极电流 (Abs) (ID):0.86 A
FET 技术:METAL-OXIDE SEMICONDUCTOR工作模式:ENHANCEMENT MODE
最高工作温度:150 °C极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):0.35 W子类别:Other Transistors
表面贴装:YESBase Number Matches:1

CMLDM8120TGTRPBFREE 数据手册

 浏览型号CMLDM8120TGTRPBFREE的Datasheet PDF文件第2页 
CMLDM8120  
CMLDM8120G*  
www.centralsemi.com  
SURFACE MOUNT  
P-CHANNEL  
ENHANCEMENT-MODE  
SILICON MOSFET  
DESCRIPTION:  
These CENTRAL SEMICONDUCTOR devices  
are Enhancement-mode P-Channel Field Effect  
Transistors, manufactured by the P-Channel DMOS  
Process, designed for high speed pulsed amplifier and  
driver applications. This MOSFET offers Low r  
and Low Theshold Voltage.  
DS(on)  
MARKING CODES:  
CMLDM8120:  
C81  
CMLDM8120G*: C8G  
SOT-563 CASE  
Device is Halogen Free by design  
*
FEATURES:  
APPLICATIONS:  
• Load/Power Switches  
• Power Supply Converter Circuits  
• Battery Powered Portable Equipment  
• Low r  
DS(on)  
• Low Threshold Voltage  
• Logic Level Compatible  
• Small SOT-563 package  
MAXIMUM RATINGS: (T =25°C)  
SYMBOL  
UNITS  
V
A
Drain-Source Voltage  
V
V
20  
8.0  
DS  
GS  
Gate-Source Voltage  
V
Continuous Drain Current (Steady State)  
Continuous Drain Current, t≤5.0s  
Continuous Source Current (Body Diode)  
Maximum Pulsed Drain Current, tp=10μs  
Maximum Pulsed Source Current, tp=10μs  
Power Dissipation (Note 1)  
I
860  
mA  
mA  
mA  
A
D
D
I
950  
I
360  
S
I
4.0  
DM  
I
4.0  
A
SM  
P
P
P
350  
mW  
mW  
mW  
°C  
D
D
D
Power Dissipation (Note 2)  
300  
Power Dissipation (Note 3)  
150  
Operating and Storage Junction Temperature  
Thermal Resistance  
T , T  
-65 to +150  
357  
J
stg  
Θ
°C/W  
JA  
ELECTRICAL CHARACTERISTICS: (T =25°C unless otherwise noted)  
A
SYMBOL  
TEST CONDITIONS  
MIN  
TYP  
MAX  
50  
UNITS  
nA  
I
I
, I  
V
V
=8.0V, V =0  
1.0  
5.0  
GSSF GSSR  
GS  
DS  
GS  
DS  
=20V, V =0  
GS  
500  
nA  
DSS  
BV  
V
V
V
V
V
V
V
=0, I =250μA  
20  
0.45  
24  
0.76  
V
V
V
Ω
Ω
Ω
Ω
DSS  
GS(th)  
SD  
DS(ON)  
DS(ON)  
DS(ON)  
DS(ON)  
D
V
V
r
r
r
r
=V , I =250μA  
=0V, I =360mA  
=4.5V, I =0.95A  
=4.5V, I =0.77A  
=2.5V, I =0.67A  
=1.8V, I =0.2A  
1.0  
0.9  
0.15  
0.142  
0.20  
0.24  
DS GS  
D
GS  
GS  
GS  
GS  
GS  
S
0.085  
0.085  
0.13  
D
D
D
D
0.19  
Notes: (1) Ceramic or aluminum core PC Board with copper mounting pad area of 4.0mm2  
(2) FR-4 Epoxy PC Board with copper mounting pad area of 4.0mm2  
(3) FR-4 Epoxy PC Board with copper mounting pad area of 1.4mm2  
R3 (18-January 2010)  

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