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CMLDM8005TIN/LEAD PDF预览

CMLDM8005TIN/LEAD

更新时间: 2024-11-11 13:02:27
品牌 Logo 应用领域
CENTRAL /
页数 文件大小 规格书
2页 586K
描述
Small Signal Field-Effect Transistor,

CMLDM8005TIN/LEAD 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:,Reach Compliance Code:not_compliant
风险等级:5.74JESD-609代码:e0
峰值回流温度(摄氏度):NOT SPECIFIED端子面层:TIN LEAD
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

CMLDM8005TIN/LEAD 数据手册

 浏览型号CMLDM8005TIN/LEAD的Datasheet PDF文件第2页 
CMLDM8005  
SURFACE MOUNT  
DUAL P-CHANNEL  
ENHANCEMENT-MODE  
SILICON MOSFETS  
www.centralsemi.com  
DESCRIPTION:  
The CENTRAL SEMICONDUCTOR CMLDM8005  
consists of Dual P-Channel Enhancement-mode silicon  
MOSFETs designed for high speed pulsed amplifier  
and driver applications. These MOSFETs offer Very  
Low r  
and Low Threshold Voltage.  
DS(ON)  
MARKING CODE: CC8  
FEATURES:  
• ESD Protection up to 2kV  
• 350mW Power Dissipation  
SOT-563 CASE  
• Very Low r  
• Low Threshold Voltage  
• Logic Level Compatible  
DS(ON)  
APPLICATIONS:  
• Load Switch / Level Shifting  
• Battery Charging  
• Small, SOT-563 Surface Mount Package  
• Complementary Dual N-Channel Device: CMLDM7005  
• Boost Switch  
• Electro-luminescent Backlighting  
MAXIMUM RATINGS: (T =25°C)  
Drain-Source Voltage  
SYMBOL  
UNITS  
V
A
V
20  
8.0  
DS  
Gate-Source Voltage  
V
V
mA  
mA  
A
GS  
Continuous Drain Current (Steady State - Note 1)  
Continuous Source Current (Body Diode)  
Maximum Pulsed Drain Current  
Power Dissipation (Note 1)  
I
650  
D
I
250  
S
I
1.0  
DM  
P
P
P
350  
mW  
mW  
mW  
°C  
D
D
D
Power Dissipation (Note 2)  
300  
Power Dissipation (Note 2)  
150  
Operating and Storage Junction Temperature  
Thermal Resistance (Note 1)  
T , T  
-65 to +150  
357  
J
stg  
Θ
°C/W  
JA  
ELECTRICAL CHARACTERISTICS PER TRANSISTOR: (T =25°C unless otherwise noted)  
A
SYMBOL  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
I
, I  
V
V
V
V
V
V
V
V
=4.5V, V =0  
10  
μA  
GSSF GSSR  
GS  
DS  
GS  
DS  
I
=16V, V =0  
GS  
100  
nA  
V
DSS  
BV  
=0, I =250μA  
20  
DSS  
GS(th)  
SD  
D
V
V
=V , I =250μA  
0.5  
1.0  
1.1  
V
DS GS  
D
=0, I =250mA  
V
GS  
GS  
GS  
GS  
S
r
r
r
=4.5V, I =350mA  
0.25  
0.37  
0.36  
0.5  
Ω
Ω
Ω
DS(ON)  
DS(ON)  
DS(ON)  
D
=2.5V, I =300mA  
D
=1.8V, I =150mA  
0.8  
D
2
Notes: (1) Ceramic or aluminum core PC Board with copper mounting pad area of 4.0mm  
2
(2) FR-4 Epoxy PC Board with copper mounting pad area of 4.0mm  
(3) FR-4 Epoxy PC Board with copper mounting pad area of 1.4mm  
2
R3 (27-September 2011)  

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