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CMLDM8002ALEADFREE PDF预览

CMLDM8002ALEADFREE

更新时间: 2024-11-11 20:02:19
品牌 Logo 应用领域
CENTRAL 开关光电二极管晶体管
页数 文件大小 规格书
2页 477K
描述
Small Signal Field-Effect Transistor, 0.00028A I(D), 50V, 2-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, PICO MINI-6

CMLDM8002ALEADFREE 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:SMALL OUTLINE, R-PDSO-G6
针数:6Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.1
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:50 V
最大漏极电流 (ID):0.00028 A最大漏源导通电阻:2.5 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):7 pF
JESD-30 代码:R-PDSO-G6JESD-609代码:e3
湿度敏感等级:1元件数量:2
端子数量:6工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:P-CHANNEL
认证状态:Not Qualified表面贴装:YES
端子面层:MATTE TIN (315)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:10
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

CMLDM8002ALEADFREE 数据手册

 浏览型号CMLDM8002ALEADFREE的Datasheet PDF文件第2页 
CMLDM8002A  
CMLDM8002AG*  
CMLDM8002AJ  
www.centralsemi.com  
SURFACE MOUNT SILICON  
DUAL P-CHANNEL  
ENHANCEMENT-MODE  
MOSFETS  
DESCRIPTION:  
These CENTRAL SEMICONDUCTOR devices are  
dual chip P-Channel enhancement-mode MOSFETs,  
manufactured by the P-Channel DMOS Process,  
designed for high speed pulsed amplifier and driver  
applications. The CMLDM8002A utilizes the USA  
pinout configuration, while the CMLDM8002AJ, utilizing  
the Japanese pinout configuration, is available as a  
special order. These special dual dransistor devices  
offer low r  
and low V  
.
DS(on)  
DS(on)  
SOT-563 CASE  
MARKING CODES: CMLDM8002A:  
C08  
CMLDM8002AG*: CG8  
CMLDM8002AJ: CJ8  
Device is Halogen Free by design  
*
APPLICATIONS:  
• Load/Power Switches  
FEATURES:  
• Dual Chip Device  
• Fast Switching  
• Power Supply Converter Circuits  
• Battery Powered Portable Equipment  
• Low r  
• Low V  
DS(on)  
• Low Threshold Voltage  
• Logic Level Compatible  
• Small SOT-563 package  
DS(on)  
MAXIMUM RATINGS: (T =25°C)  
Drain-Source Voltage  
SYMBOL  
UNITS  
V
A
V
50  
50  
DS  
DG  
GS  
Drain-Gate Voltage  
V
V
V
Gate-Source Voltage  
20  
V
Continuous Drain Current  
I
280  
mA  
mA  
A
D
Continuous Source Current (Body Diode)  
Maximum Pulsed Drain Current  
Maximum Pulsed Source Current  
Power Dissipation (Note 1)  
Power Dissipation (Note 2)  
Power Dissipation (Note 3)  
Operating and Storage Junction Temperature  
Thermal Resistance  
I
280  
S
I
1.5  
DM  
I
1.5  
A
SM  
P
P
P
350  
mW  
mW  
mW  
°C  
D
D
D
300  
150  
T , T  
-65 to +150  
357  
J
stg  
Θ
°C/W  
JA  
ELECTRICAL CHARACTERISTICS PER TRANSISTOR: (T =25°C unless otherwise noted)  
A
SYMBOL  
TEST CONDITIONS  
MIN  
MAX  
UNITS  
I
I
I
I
, I  
V
V
V
V
=20V, V =0  
100  
nA  
GSSF GSSR  
GS  
DS  
DS  
GS  
GS  
DS  
=50V, V =0  
GS  
1.0  
μA  
μA  
DSS  
=50V, V =0, T =125°C  
500  
DSS  
GS  
J
=10V, V =10V  
500  
mA  
D(ON)  
DS  
BV  
V
V
V
=0, I =10μA  
50  
1.0  
V
V
DSS  
GS(th)  
D
=V , I =250μA  
DS GS D  
2.5  
Notes: (1) Ceramic or aluminum core PC Board with copper mounting pad area of 4.0mm2  
(2) FR-4 Epoxy PC Board with copper mounting pad area of 4.0mm2  
(3) FR-4 Epoxy PC Board with copper mounting pad area of 1.4mm2  
R5 (28-January 2014)  

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