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CMLDM7585TRTIN/LEAD PDF预览

CMLDM7585TRTIN/LEAD

更新时间: 2024-11-11 21:09:27
品牌 Logo 应用领域
CENTRAL /
页数 文件大小 规格书
4页 1512K
描述
Transistor

CMLDM7585TRTIN/LEAD 技术参数

是否Rohs认证: 不符合生命周期:Active
Reach Compliance Code:unknown风险等级:5.69
最大漏极电流 (Abs) (ID):0.65 AFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-609代码:e0工作模式:ENHANCEMENT MODE
最高工作温度:150 °C极性/信道类型:N-CHANNEL AND P-CHANNEL
最大功率耗散 (Abs):0.35 W子类别:Other Transistors
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
Base Number Matches:1

CMLDM7585TRTIN/LEAD 数据手册

 浏览型号CMLDM7585TRTIN/LEAD的Datasheet PDF文件第2页浏览型号CMLDM7585TRTIN/LEAD的Datasheet PDF文件第3页浏览型号CMLDM7585TRTIN/LEAD的Datasheet PDF文件第4页 
CMLDM7585  
SURFACE MOUNT SILICON  
N-CHANNEL AND P-CHANNEL  
ENHANCEMENT-MODE  
www.centralsemi.com  
DESCRIPTION:  
The CENTRAL SEMICONDUCTOR CMLDM7585  
consists of complementary N-Channel and P-Channel  
enhancement-mode silicon MOSFETs designed for  
high speed pulsed amplifier and driver applications.  
COMPLEMENTARY MOSFETS  
These MOSFETs offer very low r  
threshold voltage.  
and low  
DS(ON)  
MARKING CODE: 87C  
FEATURES:  
• ESD protection up to 1800V (Human Body Model)  
• 350mW power pissipation  
SOT-563 CASE  
• Very low r  
• Low threshold voltage  
• Logic level compatible  
• Small, SOT-563 surface mount package  
DS(ON)  
APPLICATIONS:  
• Load/Power switches  
• Power supply converter circuits  
• Battery powered portable devices  
MAXIMUM RATINGS: (T =25°C)  
Drain-Source Voltage  
SYMBOL N-CH (Q1)  
P-CH (Q2) UNITS  
A
V
20  
8.0  
650  
V
DS  
GS  
Gate-Source Voltage  
V
V
Continuous Drain Current (Steady State)  
Maximum Pulsed Drain Current (tp=10μs)  
Power Dissipation (Note 1)  
I
mA  
D
I
1.3  
1.0  
A
DM  
P
P
P
350  
300  
mW  
mW  
mW  
°C  
D
D
D
Power Dissipation (Note 2)  
Power Dissipation (Note 3)  
150  
Operating and Storage Junction Temperature  
Thermal Resistance (Note 1)  
T , T  
-65 to +150  
357  
J
stg  
Θ
°C/W  
JA  
ELECTRICAL CHARACTERISTICS: (T =25°C)  
N-CH (Q1)  
MIN TYP MAX  
P-CH (Q2)  
MIN TYP MAX  
A
SYMBOL  
TEST CONDITIONS  
UNITS  
I
, I  
V
=4.5V, V =0  
-
-
-
-
-
-
-
1.0  
100  
-
-
-
-
-
-
-
-
-
10  
100  
-
μA  
GSSF GSSR GS  
DS  
I
V
V
V
V
V
V
V
V
V
V
V
=16V, V =0  
-
-
nA  
V
DSS  
DS  
GS  
=0, I =250μA  
BV  
20  
20  
DSS  
GS(th)  
SD  
GS  
D
V
V
V
=V , I =250μA  
0.5  
1.1  
1.1  
-
0.5  
1.0  
-
V
DS GS  
D
=0, I =200mA  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
GS  
GS  
GS  
GS  
GS  
GS  
GS  
GS  
S
=0, I =250mA  
1.1  
-
V
SD  
S
r
r
r
r
r
r
=4.5V, I =600mA  
0.14 0.23  
Ω
Ω
Ω
Ω
Ω
Ω
DS(ON)  
DS(ON)  
DS(ON)  
DS(ON)  
DS(ON)  
DS(ON)  
D
=4.5V, I =350mA  
-
-
0.25 0.36  
D
=2.5V, I =500mA  
0.2 0.275  
-
-
D
=2.5V, I =300mA  
-
-
-
-
0.7  
-
0.37 0.5  
D
=1.8V, I =350mA  
-
-
-
D
=1.8V, I =150mA  
0.8  
D
Notes: (1) Ceramic or aluminum core PC Board with copper mounting pad area of 4.0mm2  
(2) FR-4 Epoxy PC Board with copper mounting pad area of 4.0mm2  
(3) FR-4 Epoxy PC Board with copper mounting pad area of 1.4mm2  
R4 (5-June 2013)  

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