Datasheet > CMG02(TE12L,Q,M)

CMG02(TE12L,Q,M)

更新时间： 2024-11-20 21:19:19

品牌	Logo	应用领域
东芝 - TOSHIBA		二极管
页数	文件大小	规格书
4页	190K
描述
X35 PB-FREE RECTIFIER; M-FLAT; MOQ=3000; P=2W; VRRM=400V

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中文翻译

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技术参数
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CMG02(TE12L,Q,M) 技术参数

生命周期：	Active	Reach Compliance Code：	unknown
Factory Lead Time：	12 weeks	风险等级：	5.66
二极管类型：	RECTIFIER DIODE	Base Number Matches：	1

CMG02(TE12L,Q,M) 数据手册

CMG02

TOSHIBA Rectifier Silicon Diffused Type

CMG02

Unit: mm

General-Purpose Rectifier Applications

•

Average forward current: I

= 2.0 A

②

F (AV)

Repetitive peak reverse voltage: V

= 400 V

RRM

Suitable for high-density board assembly due to the use of a small

surface-mount package, M−FLAT^TM

Absolute Maximum Ratings (Ta = 25°C)

①

0.16

Characteristics

Symbol

Rating

Unit

1.75 ± 0.1

+ 0.2

2.4 − 0.1

Repetitive peak reverse voltage

Average forward current

Non-repetitive peak surge current

Junction temperature

400

RRM

2.0

F (AV)

80 (50 Hz)

−40 to 150

FSM

① ANODE

② CATHODE

°C

Storage temperature

stg

Note: Using continuously under heavy loads (e.g. the application of high

temperature/current/voltage and the significant change in

temperature, etc.) may cause this product to decrease in the

reliability significantly even if the operating conditions (i.e.

operating temperature/current/voltage, etc.) are within the

absolute maximum ratings.

JEDEC

―

JEITA

TOSHIBA

3-4E1A

Weight: 0.023 g (typ.)

Please design the appropriate reliability upon reviewing the

Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and

individual reliability data (i.e. reliability test report and estimated failure rate, etc).

Electrical Characteristics (Ta = 25°C)

Characteristics

Symbol

Test Condition

Min

Typ.

Max

Unit

FM(1)

FM(2)

RRM

=1.0 A

= 2.0 A

―

0.86

0.9

―

1.1

Peak forward voltage

Peak repetitive reverse current

= 400 V

μA

RRM

Device mounted on a ceramic board

(board size: 50 mm × 50 mm)

(soldering land: 2 mm × 2 mm)

(board thickness: 0.64 mm)

―

Device mounted on a glass-epoxy

board

(board size: 50 mm × 50 mm)

(soldering land: 6 mm × 6 mm)

(board thickness: 1.6 mm)

Thermal resistance

(junction to ambient)

110

th (j-a)

°C/W

Device mounted on a glass-epoxy

board

(board size: 50 mm × 50 mm)

(soldering land: 2.1 mm × 1.4 mm)

(board thickness: 1.6 mm)

―

180

Thermal resistance

(junction to lead)

―

°C/W

th (j-ℓ)

Start of commercial production

2002-11

2013-11-01

12 3 4

中文翻译

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