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CMG07

更新时间： 2024-11-25 14:58:27
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
4页 366K
描述
EOL announced

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中文翻译

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CMG07 数据手册

 浏览型号CMG07的Datasheet PDF文件第2页浏览型号CMG07的Datasheet PDF文件第3页浏览型号CMG07的Datasheet PDF文件第4页 
CMG07  
TOSHIBA Rectifier Silicon Diffused Type  
CMG07  
○ General-Purpose Rectifiers  
Unit: mm  
•
•
•
•
Repetitive peak reverse voltage : V  
= 400 V  
RRM  
Average forward current  
Peak forward voltage  
: I  
= 1 A  
F (AV)  
: V  
FM  
=1.1 V (max) @I = 1 A  
F
Suitable for high-density board assembly due to the use of a small  
Toshiba Nickname: M−FLATTM  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Repetitive peak reverse voltage  
Average forward current  
Symbol  
Rating  
400  
Unit  
V
V
RRM  
I
1 (Note1)  
30 (50 Hz)  
150  
A
F (AV)  
Non-repetitive peak forward surge current  
Junction temperature  
I
A
FSM  
T
°C  
°C  
j
Storage temperature  
T
-40 to 150  
stg  
JEDEC  
JEITA  
―
―
Note1:  
Ta=78°C Device mounted on a ceramic board  
Board size  
: 50 mm × 50 mm  
: 2 mm × 2 mm  
: 0.64 mm  
Soldering land size  
Board thickness  
TOSHIBA  
3-4E1S  
Rectangular waveform : α = 180°  
Weight: 0.023 g (typ.)  
Note 2:  
Using continuously under heavy loads (e.g. the application  
of high temperature/current/voltage and the significant change in temperature, etc.) may cause this  
product to decrease in the reliability significantly even if the operating conditions (i.e. operating  
temperature/current/voltage, etc.) are within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability  
Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e.  
reliability test report and estimated failure rate, etc).  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
= 0.1 A (pulse test)  
Min  
―
Typ.  
0.80  
0.91  
0.94  
―
Max  
―
Unit  
V
V
V
V
I
I
I
FM (1)  
FM (2)  
FM (3)  
FM  
FM  
FM  
Peak forward voltage  
= 0.7 A (pulse test)  
= 1 A (pulse test)  
―
―
―
1.1  
10  
Peak repetitive reverse current  
I
V
= 400 V (pulse test)  
RRM  
―
μA  
RRM  
Device mounted on a ceramic board  
board size  
soldering land size  
board thickness  
50 mm × 50 mm  
2 mm × 2 mm  
0.64 mm  
―
―
―
―
60  
Device mounted on a glass-epoxy board  
board size  
soldering land size  
board thickness  
Thermal resistance  
(junction to ambient)  
50 mm × 50 mm  
6 mm × 6 mm  
1.6 mm  
125  
R
°C/W  
°C/W  
th (j-a)  
Device mounted on a glass-epoxy board  
board size  
soldering land size  
board thickness  
50 mm × 50 mm  
2.1 mm × 1.4 mm  
1.6 mm  
―
―
―
―
200  
16  
―
Thermal resistance (junction to lead)  
R
th (j-ℓ)  
Start of commercial production  
2008-10  
1
2018-07-06  
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