CMG05
TOSHIBA Rectifier Silicon Diffused Type
CMG05
○ General Power Supply Rectification
Unit: mm
•
•
•
•
Repetitive peak reverse voltage : V
= 400 V
RRM
Average forward current
Peak forward voltage
: I
= 1.0 A
F (AV)
: VFM = 1.1 V (max)
The use of small, thin surface-mount package is optimum way for
high-density mounting.
Nickname: M-FLATTM
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Repetitive peak reverse voltage
Average forward current
Symbol
Rating
400
Unit
V
V
RRM
1
2
ANODE
I
1.0 (Note 1)
15 (50 Hz)
-40 to 150
A
F (AV)
CATHODE
Non-repetitive peak forward surge current
I
A
FSM
T
j
°C
°C
Junction temperature
Storage temperature
T
-40 to 150
stg
JEDEC
JEITA
―
―
Note 1: Ta = 75°C
board size
Soldering land size
Device mounted on a ceramic board
:50 mm × 50 mm
:2 mm × 2 mm
:0.64 mm
TOSHIBA
3-4E1S
board thickness
Half-sine waveform
Weight: 0.023 g (typ.)
:α = 180°
Note:
Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
= 0.1 A (pulse test)
Min
―
Typ.
0.80
0.91
0.94
―
Max
―
Unit
V
V
FM(1)
V
FM(2)
V
FM(3)
I
RRM
I
I
I
FM
FM
FM
Peak forward voltage
= 0.7 A (pulse test)
= 1.0 A (pulse test)
―
―
―
1.1
10
Repetitive peak reverse current
V
= 400 V (pulse test)
―
μA
RRM
Device mounted on a ceramic board
board size
soldering land size
board thickness
50 mm × 50 mm
2 mm × 2 mm
0.64 mm
―
―
―
―
60
Device mounted on a glass-epoxy board
board size
soldering land size
board thickness
50 mm × 50 mm
6 mm × 6 mm
1.6 mm
Thermal resistance
(junction to ambient)
R
th (j-a)
135
°C/W
Device mounted on a glass-epoxy board
board size
soldering land size
board thickness
50 mm × 50 mm
2.1 mm × 1.4 mm
1.6 mm
―
―
―
―
210
16
Thermal resistance (junction to lead)
R
th (j-ℓ)
―
°C/W
Start of commercial production
2007-07
1
2019-04-19