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CMG03(T2L,TEMQ) PDF预览

CMG03(T2L,TEMQ)

更新时间: 2024-11-24 21:20:07
品牌 Logo 应用领域
东芝 - TOSHIBA 测试光电二极管
页数 文件大小 规格书
4页 373K
描述
Rectifier Diode

CMG03(T2L,TEMQ) 技术参数

生命周期:ActiveReach Compliance Code:unknown
风险等级:5.67应用:GENERAL PURPOSE
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODE最大正向电压 (VF):1.1 V
JESD-30 代码:R-PDSO-F2最大非重复峰值正向电流:80 A
元件数量:1相数:1
端子数量:2最高工作温度:150 °C
最低工作温度:-40 °C最大输出电流:2 A
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE最大重复峰值反向电压:600 V
最大反向电流:10 µA反向测试电压:600 V
表面贴装:YES端子形式:FLAT
端子位置:DUALBase Number Matches:1

CMG03(T2L,TEMQ) 数据手册

 浏览型号CMG03(T2L,TEMQ)的Datasheet PDF文件第2页浏览型号CMG03(T2L,TEMQ)的Datasheet PDF文件第3页浏览型号CMG03(T2L,TEMQ)的Datasheet PDF文件第4页 
CMG03  
TOSHIBA Rectifier Silicon Diffused Type  
CMG03  
General-Purpose Rectifiers  
Unit: mm  
Repetitive peak reverse voltage : V  
= 600 V  
RRM  
Average forward current  
Peak forward voltage  
: I  
= 2.0 A  
F (AV)  
: VFM = 1.1 V (max)  
Suitable for high-density board assembly due to the use of a small  
Toshiba Nickname: MFLATTM  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Repetitive peak reverse voltage  
Average forward current  
Symbol  
Rating  
600  
Unit  
V
V
RRM  
1
2
ANODE  
I
2.0 (Note1)  
80 (50 Hz)  
40 to 150  
40 to 150  
A
F (AV)  
CATHODE  
Non-repetitive peak forward surge current  
Junction temperature  
I
A
FSM  
T
°C  
°C  
j
Storage temperature  
T
stg  
JEDEC  
JEITA  
Note 1: T=106°C  
Device mounted on a ceramic board  
board size : 50 mm × 50 mm  
Soldering land size : 2 mm × 2 mm  
board thickness : 0.64 mm  
Half-sine waveform : α = 180°  
TOSHIBA  
3-4E1S  
Weight: 0.023 g (typ.)  
Note : Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to  
decrease in the reliability significantly even if the operating conditions (i.e. operating  
temperature/current/voltage, etc.) are within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc.).  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
= 1.0 A (Pulse test)  
Min  
Typ.  
0.88  
0.92  
Max  
Unit  
V
V
FM(1)  
V
FM(2)  
I
RRM  
I
I
FM  
FM  
Peak forward voltage  
= 2.0 A (Pulse test)  
= 600 V (Pulse test)  
1.1  
10  
V
Repetitive peak reverse current  
V
μA  
RRM  
Device mounted on a ceramic board  
board size  
soldering land size  
board thickness  
50 mm × 50 mm  
2 mm × 2 mm  
0.64 mm  
60  
Device mounted on a glass-epoxy board  
board size  
soldering land size  
board thickness  
Thermal resistance  
(junction to ambient)  
50 mm × 50 mm  
6 mm × 6 mm  
1.6 mm  
R
110  
°C/W  
°C/W  
th (j-a)  
Device mounted on a glass-epoxy board  
board size  
soldering land size  
board thickness  
50 mm × 50 mm  
2.1 mm × 1.4 mm  
1.6 mm  
180  
16  
Thermal resistance (junction to lead)  
R
th (j-)  
Start of commercial production  
2004-06  
1
2018-10-01  

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