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CD74HCT73ME4 PDF预览

CD74HCT73ME4

更新时间： 2024-01-28 04:37:08
品牌 Logo 应用领域
德州仪器 - TI 触发器锁存器逻辑集成电路光电二极管
页数 文件大小 规格书
13页 278K
描述
Dual J-K Flip-Flop with Reset Negative-Edge Trigger

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CD74HCT73ME4 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：SOIC
包装说明：GREEN, PLASTIC, MS-012AB, SOIC-14针数：14
Reach Compliance Code：unknownHTS代码：8542.39.00.01
风险等级：5.56Is Samacsys：N
系列：HCTJESD-30 代码：R-PDSO-G14
JESD-609代码：e4长度：8.65 mm
负载电容（CL）：50 pF逻辑集成电路类型：J-K FLIP-FLOP
最大频率@ Nom-Sup：20000000 Hz最大I（ol）：0.004 A
湿度敏感等级：1位数：2
功能数量：2端子数量：14
最高工作温度：125 °C最低工作温度：-55 °C
输出极性：COMPLEMENTARY封装主体材料：PLASTIC/EPOXY
封装代码：SOP封装等效代码：SOP14,.25
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
包装方法：TUBE峰值回流温度（摄氏度）：260
电源：5 V传播延迟（tpd）：57 ns
认证状态：Not Qualified座面最大高度：1.75 mm
子类别：FF/Latches最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：4.5 V标称供电电压 (Vsup)：5 V
表面贴装：YES技术：CMOS
温度等级：MILITARY端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：GULL WING端子节距：1.27 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
触发器类型：NEGATIVE EDGE宽度：3.9 mm
最小 fmax：20 MHzBase Number Matches：1

CD74HCT73ME4 数据手册

 浏览型号CD74HCT73ME4的Datasheet PDF文件第5页浏览型号CD74HCT73ME4的Datasheet PDF文件第6页浏览型号CD74HCT73ME4的Datasheet PDF文件第7页浏览型号CD74HCT73ME4的Datasheet PDF文件第9页浏览型号CD74HCT73ME4的Datasheet PDF文件第10页浏览型号CD74HCT73ME4的Datasheet PDF文件第11页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Sep-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CDIP  
CDIP  
PDIP  
Drawing  
5962-8515301CA  
CD54HC73F  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
J
J
14  
14  
14  
14  
1
1
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
CD54HC73F3A  
CD74HC73E  
J
1
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
CD74HC73EE4  
CD74HC73M  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SOIC  
SOIC  
N
D
D
D
D
D
D
N
N
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HC73M96  
CD74HC73M96E4  
CD74HC73ME4  
CD74HC73MT  
CD74HC73MTE4  
CD74HCT73E  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
CD74HCT73EE4  
CD74HCT73M  
CD74HCT73ME4  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
Addendum-Page 1  
1...567891011...13

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