是否Rohs认证: | 符合 | 生命周期: | Transferred |
零件包装代码: | D2PAK | 包装说明: | PLASTIC, SOT-404, D2PAK-3 |
针数: | 3 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.14 | 内置保护: | OVER CURRENT; OVER VOLTAGE; THERMAL |
接口集成电路类型: | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | JESD-30 代码: | R-PSSO-G2 |
JESD-609代码: | e3 | 长度: | 10 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 2 | 输出电流流向: | SOURCE |
标称输出峰值电流: | 24 A | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TO-263 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 峰值回流温度(摄氏度): | 250 |
认证状态: | Not Qualified | 座面最大高度: | 4.5 mm |
表面贴装: | YES | 端子面层: | TIN |
端子形式: | GULL WING | 端子节距: | 2.54 mm |
端子位置: | SINGLE | 处于峰值回流温度下的最长时间: | 40 |
断开时间: | 140 µs | 接通时间: | 30 µs |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
BUK130-50DL | NXP |
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Logic level TOPFET SMD version of BUK119-50DL | |
BUK130-50DL/T3 | NXP |
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IC 43 A BUF OR INV BASED PRPHL DRVR, PSSO2, PLASTIC, SOT-404, D2PAK-3, Peripheral Driver | |
BUK135-50L | NXP |
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Logic level TOPFET | |
BUK135-50L,118 | NXP |
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BUK135-50L - Logic level TOPFET SMD version of BUK124-50L D2PAK 5-Pin | |
BUK136-50L | NXP |
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Logic level TOPFET SMD version of BUK125-50L | |
BUK138-50DL | NXP |
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Logic level TOPFET D-PAK version of BUK117-50DL | |
BUK139-50DL | NXP |
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Logic level TOPFET D-PAK version of BUK118-50DL | |
BUK139-50DL,118 | NXP |
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BUK139-50DL - Logic level TOPFET D-PAK version of BUK118-50DL DPAK 3-Pin | |
BUK148-50DL | ETC |
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TRANSISTOR | MOSFET | N-CHANNEL | 50V V(BR)DSS | 8A I(D) | TO-220VAR | |
BUK148-50DL,127 | NXP |
获取价格 |
IC 12 A BUF OR INV BASED PRPHL DRVR, PSIP3, PLASTIC, SOT-226, 3 PIN, Peripheral Driver |