5秒后页面跳转
捷配首页

Datasheet > BCP69T1/D
BCP69T1/D PDF预览

BCP69T1/D

更新时间： 2024-02-13 02:41:05
品牌 Logo 应用领域
其他 - ETC 晶体晶体管
页数 文件大小 规格书
8页 52K
描述
PNP Epitaxial Transistor

阅读下载

中文翻译

获取价格

BCP69T1/D 技术参数

是否Rohs认证： 不符合生命周期：Transferred
包装说明：SMALL OUTLINE, R-PDSO-G4Reach Compliance Code：unknown
风险等级：5.58外壳连接：COLLECTOR
最大集电极电流 (IC)：1 A集电极-发射极最大电压：25 V
配置：SINGLE最小直流电流增益 (hFE)：60
JEDEC-95代码：TO-261AAJESD-30 代码：R-PDSO-G4
JESD-609代码：e0元件数量：1
端子数量：4最高工作温度：150 °C
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：SMALL OUTLINE极性/信道类型：PNP
功耗环境最大值：1.5 W最大功率耗散 (Abs)：1.5 W
认证状态：Not Qualified子类别：Other Transistors
表面贴装：YES端子面层：Tin/Lead (Sn/Pb)
端子形式：GULL WING端子位置：DUAL
晶体管元件材料：SILICON标称过渡频率 (fT)：60 MHz
Base Number Matches：1

BCP69T1/D 数据手册

 浏览型号BCP69T1/D的Datasheet PDF文件第1页浏览型号BCP69T1/D的Datasheet PDF文件第2页浏览型号BCP69T1/D的Datasheet PDF文件第3页浏览型号BCP69T1/D的Datasheet PDF文件第5页浏览型号BCP69T1/D的Datasheet PDF文件第6页浏览型号BCP69T1/D的Datasheet PDF文件第7页 
BCP69T1  
INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE  
POWER DISSIPATION  
The power dissipation of the SOT-223 is a function of the  
input pad size. These can vary from the minimum pad size  
for soldering to the pad size given for maximum power  
dissipation. Power dissipation for a surface mount device is  
the equation for an ambient temperature T of 25°C, one can  
calculate the power dissipation of the device which in this  
case is 1.5 watts.  
A
150°C – 25°C  
determined by T , the maximum rated junction  
J(max)  
PD  
=
= 1.5 watts  
83.3°C/W  
temperature of the die, R , the thermal resistance from the  
θJA  
device junction to ambient; and the operating temperature,  
The 83.3°C/W for the SOT-223 package assumes the  
recommended collector pad area of 965 sq. mils on a glass  
epoxy printed circuit board to achieve a power dissipation of  
1.5 watts. If space is at a premium, a more realistic approach  
T . Using the values provided on the data sheet for the  
A
SOT-223 package, P can be calculated as follows.  
D
TJ(max) – TA  
is to use the device at a P of 833 mW using the footprint  
PD  
=
D
Rθ  
JA  
shown. Using a board material such as Thermal Clad, a  
power dissipation of 1.6 watts can be achieved using the  
same footprint.  
The values for the equation are found in the maximum  
ratings table on the data sheet. Substituting these values into  
MOUNTING PRECAUTIONS  
The melting temperature of solder is higher than the rated  
temperature of the device. When the entire device is heated  
to a high temperature, failure to complete soldering within  
a short time could result in device failure. Therefore, the  
following items should always be observed in order to  
minimize the thermal stress to which the devices are  
subjected.  
• The soldering temperature and time should not exceed  
260°C for more than 10 seconds.  
• When shifting from preheating to soldering, the maximum  
temperature gradient should be 5°C or less.  
• After soldering has been completed, the device should be  
allowed to cool naturally for at least three minutes.  
Gradual cooling should be used as the use of forced  
cooling will increase the temperature gradient and result  
in latent failure due to mechanical stress.  
• Always preheat the device.  
• The delta temperature between the preheat and soldering  
should be 100°C or less.*  
• Mechanical stress or shock should not be applied during  
• When preheating and soldering, the temperature of the  
leads and the case must not exceed the maximum  
temperature ratings as shown on the data sheet. When  
using infrared heating with the reflow soldering method,  
the difference should be a maximum of 10°C.  
cooling  
* Soldering a device without preheating can cause  
excessive thermal shock and stress which can result in  
damage to the device.  
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS  
Surface mount board layout is a critical portion of the total  
design. The footprint for the semiconductor packages must  
be the correct size to insure proper solder connection  
interface between the board and the package. With the  
correct pad geometry, the packages will self align when  
subjected to a solder reflow process.  
0.15  
3.8  
0.079  
2.0  
0.248  
6.3  
0.091  
2.3  
0.091  
2.3  
0.079  
2.0  
inches  
mm  
0.059  
1.5  
0.059  
1.5  
0.059  
1.5  
SOT-223  
http://onsemi.com  
4
12345678

中文翻译

下载PDF

与BCP69T1/D相关器件

型号 品牌 获取价格 描述 数据表
BCP69T1G ONSEMI

获取价格

 		PNP Silicon Epitaxial Transistor
BCP69T3 MOTOROLA

获取价格

 		1A, 25V, PNP, Si, POWER TRANSISTOR, TO-261AA
BCP69T3 ONSEMI

获取价格

 		1A, 20V, PNP, Si, POWER TRANSISTOR, TO-261AA, CASE 318E-04, TO-261, 4 PIN
BCP69TA ZETEX

获取价格

 		Power Bipolar Transistor, 1A I(C), 20V V(BR)CEO, 1-Element, PNP, Silicon, Plastic/Epoxy, 4
BCP69TA DIODES

获取价格

 		Power Bipolar Transistor, 1A I(C), 20V V(BR)CEO, 1-Element, PNP, Silicon, Plastic/Epoxy, 4
BCP69-TAPE-7 NXP

获取价格

 		TRANSISTOR 1 A, 20 V, PNP, Si, POWER TRANSISTOR, BIP General Purpose Power
BCP69TC DIODES

获取价格

 		Power Bipolar Transistor, 1A I(C), 20V V(BR)CEO, 1-Element, PNP, Silicon, Plastic/Epoxy, 4
BCP69TRL YAGEO

获取价格

 		Power Bipolar Transistor, 1A I(C), 20V V(BR)CEO, 1-Element, PNP, Silicon, Plastic/Epoxy, 4
BCP69TRL NXP

获取价格

 		TRANSISTOR 1 A, 20 V, PNP, Si, POWER TRANSISTOR, BIP General Purpose Power
BCP69TRL13 NXP

获取价格

 		TRANSISTOR 0.025 A, 30 V, PNP, Si, POWER TRANSISTOR, BIP General Purpose Power

与BCP69T1/D相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证