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BCP53-10T1 PDF预览

BCP53-10T1

更新时间: 2024-11-11 23:34:51
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4页 52K
描述
TRANSISTOR | BJT | PNP | 80V V(BR)CEO | 1.5A I(C) | SOT-223

BCP53-10T1 数据手册

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BCP53T1 Series  
Preferred Devices  
PNP Silicon  
Epitaxial Transistors  
This PNP Silicon Epitaxial transistor is designed for use in audio  
amplifier applications. The device is housed in the SOT-223 package  
which is designed for medium power surface mount applications.  
http://onsemi.com  
High Current: 1.5 Amps  
NPN Complement is BCP56  
MEDIUM POWER  
HIGH CURRENT  
SURFACE MOUNT  
PNP TRANSISTORS  
The SOT-223 Package can be soldered using wave or reflow. The  
formed leads absorb thermal stress during soldering, eliminating the  
possibility of damage to the die  
Available in 12 mm Tape and Reel  
Use BCP53T1 to order the 7 inch/1000 unit reel.  
Use BCP53T3 to order the 13 inch/4000 unit reel.  
COLLECTOR 2,4  
Device Marking:  
BCP53T1 = AH  
BCP53–10T1 = AH–10  
BCP53–16T1 = AH–16  
BASE  
1
EMITTER 3  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
Collector Current  
Symbol  
Value  
–80  
Unit  
Vdc  
Vdc  
Vdc  
Adc  
V
CEO  
V
CBO  
V
EBO  
MARKING DIAGRAM  
4
–100  
–5.0  
1.5  
1
2
3
AHxxx  
I
C
SOT–223  
CASE 318E  
STYLE 1  
Total Power Dissipation  
P
D
@ T = 25°C (Note 1.)  
1.5  
12  
Watts  
mW/°C  
A
AHxxx = Device Code  
Derate above 25°C  
xxx  
= –10 or –16  
Operating and Storage  
Temperature Range  
T , T  
–65 to  
+150  
°C  
J
stg  
ORDERING INFORMATION  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
Device  
Package  
SOT–223  
SOT–223  
SOT–223  
Shipping  
Thermal Resistance,  
Junction to Ambient  
(surface mounted)  
R
83.3  
°C/W  
θJA  
BCP53T1  
1000/Tape & Reel  
1000/Tape & Reel  
1000/Tape & Reel  
BCP53–10T1  
BCP53–16T1  
Lead Temperature for Soldering,  
0.0625from case  
Time in Solder Bath  
T
L
260  
10  
°C  
Sec  
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in.  
x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.  
Preferred devices are recommended choices for future use  
and best overall value.  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
November, 2000 – Rev. 2  
BCP53T1/D  

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