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BC847PN_1 PDF预览

BC847PN_1

更新时间: 2024-11-28 03:09:31
品牌 Logo 应用领域
美台 - DIODES 晶体晶体管
页数 文件大小 规格书
2页 128K
描述
COMPLEMENTARY PAIR SMALL SIGNAL SURFACE MOUNT TRANSISTOR

BC847PN_1 数据手册

 浏览型号BC847PN_1的Datasheet PDF文件第2页 
BC847PN  
BC847PN  
NPN  
PNP  
NPN  
PNP  
Complementary Surface Mount General Purpose Si-Planar Transistors  
Komplementäre Si-Planar Transistoren für die Oberflächenmontage  
Version 2006-09-05  
Power dissipation  
Verlustleistung  
300 mW  
SOT-363  
0.01 g  
2±0.1  
2 x 0.65  
0.9±0.1  
Plastic case  
Kunststoffgehäuse  
5
4
6
Type  
Code  
Weight approx. – Gewicht ca.  
1
2
3
Plastic material has UL classification 94V-0  
Gehäusematerial UL94V-0 klassifiziert  
2.4  
Dimensions - Maße [mm]  
Standard packaging taped and reeled  
Standard Lieferform gegurtet auf Rolle  
6 = C1  
1 = E1  
5 = B2  
2 = B1  
4 = E2  
3 = C2  
Maximum ratings (TA = 25°C)  
per transistor – pro Transistor  
Grenzwerte (TA = 25°C)  
BC847PN  
45 V  
Collector-Emitter-volt. – Kollektor-Emitter-Spannung  
Collector-Base-voltage – Kollektor-Basis-Spannung  
Emitter-Base-voltage – Emitter-Basis-Spannung  
Power dissipation – Verlustleistung  
B open  
E open  
C open  
VCBO  
VCEO  
VEB0  
Ptot  
IC  
50 V  
6 V  
300 mW 1)  
100 mA  
200 mA  
200 mA  
Collector current – Kollektorstrom (dc)  
Peak Collector current – Kollektor-Spitzenstrom  
Peak Base current – Basis-Spitzenstrom  
ICM  
IBM  
Junction temperature – Sperrschichttemperatur  
Storage temperature – Lagerungstemperatur  
Tj  
TS  
-55...+150°C  
-55…+150°C  
Characteristics (Tj = 25°C)  
Kennwerte (Tj = 25°C)  
Min.  
Typ.  
Max.  
DC current gain – Kollektor-Basis-Stromverhältnis  
VCE = 5 V, IC = 2 mA  
T1 - NPN  
T2 - PNP  
hFE  
hFE  
200  
220  
450  
475  
- VCE = 5 V, - IC = 2 mA  
Collector-Emitter saturation voltage – Kollektor-Sättigungsspannung 2)  
IC = 10 mA, IB = 0.5 mA  
IC = 100 mA, IB = 5 mA  
VCEsat  
VCEsat  
250 mV  
600 mV  
T1 - NPN  
T2 - PNP  
- IC = 10 mA, - IB = 0.5 mA  
- IC = 100 mA, - IB = 5 mA  
- VCEsat  
- VCEsat  
300 mV  
650 mV  
1
2
Mounted on P.C. board with 3 mm2 copper pad at each terminal  
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluss  
Tested with pulses tp = 300 µs, duty cycle ≤ 2% – Gemessen mit Impulsen tp = 300 µs, Schaltverhältnis ≤ 2%  
© Diotec Semiconductor AG  
http://www.diotec.com/  
1
 
 

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