BC847BPDXV6,
SBC847BPDXV6
NPN/PNP Dual General
Purpose Transistor
This transistor is designed for general purpose amplifier
applications. It is housed in the SOT−563 which is designed for low
power surface mount applications.
http://onsemi.com
Features
(3)
(2)
(1)
Q
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
Q
1
2
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS − NPN
(4)
(5)
(6)
Rating
Symbol
Value
45
Unit
V
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
V
CEO
BC847BPDX6T1
V
CBO
V
EBO
50
V
4
5
6.0
V
6
Collector Current −
Continuous
I
C
100
mAdc
3
2
1
SOT−563
CASE 463A
MAXIMUM RATINGS − PNP
Rating
Symbol
Value
−45
Unit
V
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
V
CEO
V
CBO
V
EBO
MARKING DIAGRAM
−50
V
−5.0
−100
V
4F MG
G
Collector Current −
Continuous
I
C
mAdc
1
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
4F = Specific Device Code
M
= Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Symbol
Max
Unit
ORDERING INFORMATION
Total Device Dissipation (Note 1)
P
†
D
Device
Package
Shipping
T = 25°C
357
2.9
mW
mW/°C
A
BC847BPDXV6T1G SOT−563
4 mm pitch
(Pb−Free) 4000/Tape & Reel
Derate above 25°C
Thermal Resistance −
R
°C/W
q
JA
Junction-to-Ambient (Note 1)
350
SBC847BPDXV6T1G SOT−563
2 mm pitch
(Pb−Free) 4000/Tape & Reel
Characteristic
(Both Junctions Heated)
Symbol
Max
Unit
BC847BPDXV6T5G SOT−563
2 mm pitch
(Pb−Free) 8000/Tape & Reel
Total Device Dissipation (Note 1)
P
D
T = 25°C
Derate above 25°C
500
4.0
mW
mW/°C
A
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Thermal Resistance −
Junction-to-Ambient (Note 1)
R
°C/W
q
JA
250
Junction and Storage Temperature Range T , T
−55 to
°C
J
stg
+150
1. FR−4 @ Minimum Pad
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
May, 2013 − Rev. 2
BC847BPDXV6T1/D