BC847BPDXV6T1,
BC847BPDXV6T5
Dual General Purpose
Transistor
NPN/PNP Dual (Complementary)
http://onsemi.com
This transistor is designed for general purpose amplifier
applications. It is housed in the SOT−563 which is designed for low
power surface mount applications.
(3)
(2)
(1)
Q
• Lead−Free Solder Plating
MAXIMUM RATINGS − NPN
Q
1
2
Rating
Symbol
Value
45
Unit
V
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
V
CEO
V
CBO
V
EBO
(4)
(5)
(6)
50
V
BC847BPDX6T1
6.0
V
Collector Current −
Continuous
I
C
100
mAdc
4
5
6
MAXIMUM RATINGS − PNP
Rating
3
2
1
Symbol
Value
−45
Unit
V
SOT−563
CASE 463A
PLASTIC
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
V
CEO
V
CBO
V
EBO
−50
V
−5.0
−100
V
MARKING DIAGRAM
Collector Current −
Continuous
I
C
mAdc
4F MG
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
G
1
4F = Specific Device Code
M
= Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Symbol
Max
Unit
ORDERING INFORMATION
Total Device Dissipation T = 25°C
P
D
357
(Note 1)
2.9
A
mW
mW/°C
†
Device
Package
Shipping
Derate above 25°C
(Note 1)
BC847BPDXV6T1 SOT−563
4 mm pitch
4000/Tape & Reel
Thermal Resistance −
Junction-to-Ambient
R
350
(Note 1)
°C/W
q
JA
BC847BPDXV6T1G SOT−563
2 mm pitch
(Pb−Free) 4000/Tape & Reel
Characteristic
(Both Junctions Heated)
Symbol
Max
Unit
BC847BPDXV6T5 SOT−563
4 mm pitch
8000/Tape & Reel
Total Device Dissipation
P
D
500
(Note 1)
4.0
T = 25°C
mW
mW/°C
A
BC847BPDXV6T5G SOT−563
2 mm pitch
(Pb−Free) 8000/Tape & Reel
Derate above 25°C
(Note 1)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Thermal Resistance −
Junction-to-Ambient
R
250
(Note 1)
°C/W
°C
q
JA
Junction and Storage
Temperature Range
T , T
J
−55 to +150
stg
1. FR−4 @ Minimum Pad
© Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
September, 2005 − Rev. 1
BC847BPDXV6T1/D